ASROCK H570 Istruzioni per l'uso

Version 1.0

Published February 2021

Copyright Notice:

No part of this documentation may be reproduced, transcribed, transmitted, or

translated in any language, in any form or by any means, except duplication of

documentation by the purchaser for backup purpose, without written consent of

ASRock Inc.

Products and corporate names appearing in this documentation may or may not

be registered trademarks or copyrights of their respective companies, and are used

only for identication or explanation and to the owners’ benet, without intent to

infringe.

Disclaimer:

Specications and information contained in this documentation are furnished for

informational use only and subject to change without notice, and should not be

constructed as a commitment by ASRock. ASRock assumes no responsibility for

any errors or omissions that may appear in this documentation.

With respect to the contents of this documentation, ASRock does not provide

warranty of any kind, either expressed or implied, including but not limited to

the implied warranties or conditions of merchantability or tness for a particular

purpose.

In no event shall ASRock, its directors, ocers, employees, or agents be liable for

any indirect, special, incidental, or consequential damages (including damages for

loss of prots, loss of business, loss of data, interruption of business and the like),

even if ASRock has been advised of the possibility of such damages arising from any

defect or error in the documentation or product.

is device complies with Part 15 of the FCC Rules. Operation is subject to the following

two conditions:

(1) this device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that

may cause undesired operation.

CALIFORNIA, USA ONLY

e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance

controlled in Perchlorate Best Management Practices (BMP) regulations passed by the

California Legislature. When you discard the Lithium battery in California, USA, please

follow the related regulations in advance.

“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/

perchlorate”

ASRock Website: http://www.asrock.com

AUSTRALIA ONLY

Our goods come with guarantees that cannot be excluded under the Australian Consumer

Law. You are entitled to a replacement or refund for a major failure and compensation for

any other reasonably foreseeable loss or damage caused by our goods. You are also entitled

to have the goods repaired or replaced if the goods fail to be of acceptable quality and the

failure does not amount to a major failure. If you require assistance please call ASRock Tel

: +886-2-28965588 ext.123 (Standard International call charges apply)

e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI

logo are trademarks or registered trademarks of HDMI Licensing LLC in the United

States and other countries.

INTEL END USER SOFTWARE LICENSE AGREEMENT

IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.

LICENSE. Licensee has a license under Intel’s copyrights to reproduce Intel’s Soware

only in its unmodied and binary form, (with the accompanying documentation, the

“Soware”) for Licensee’s personal use only, and not commercial use, in connection with

Intel-based products for which the Soware has been provided, subject to the following

conditions:

(a) Licensee may not disclose, distribute or transfer any part of the Soware, and You agree

to prevent unauthorized copying of the Soware.

(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.

(c) Licensee may not sublicense the Soware.

(d) e Soware may contain the soware and other intellectual property of third party

suppliers, some of which may be identied in, and licensed in accordance with, an enclosed

license.txt le or other text or le.

(e) Intel has no obligation to provide any support, technical assistance or updates for the

Soware.

OWNERSHIP OF SOFTWARE AND COPYRIGHTS. Title to all copies of the Soware

remains with Intel or its licensors or suppliers. e Soware is copyrighted and protected

by the laws of the United States and other countries, and international treaty provisions.

Licensee may not remove any copyright notices from the Soware. Except as otherwise

expressly provided above, Intel grants no express or implied right under Intel patents,

copyrights, trademarks, or other intellectual property rights. Transfer of the license termi-

nates Licensee’s right to use the Soware.

DISCLAIMER OF WARRANTY. e Soware is provided “AS IS” without warranty of

any kind, EITHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION,

WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PUR-

POSE.

LIMITATION OF LIABILITY. NEITHER INTEL NOR ITS LICENSORS OR SUPPLIERS

WILL BE LIABLE FOR ANY LOSS OF PROFITS, LOSS OF USE, INTERRUPTION OF

BUSINESS, OR INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAG-

ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN

IF INTEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

LICENSE TO USE COMMENTS AND SUGGESTIONS. is Agreement does NOT

obligate Licensee to provide Intel with comments or suggestions regarding the Soware.

However, if Licensee provides Intel with comments or suggestions for the modication,

correction, improvement or enhancement of (a) the Soware or (b) Intel products or

processes that work with the Soware, Licensee grants to Intel a non-exclusive, worldwide,

perpetual, irrevocable, transferable, royalty-free license, with the right to sublicense, under

Licensee’s intellectual property rights, to incorporate or otherwise utilize those comments

and suggestions.

TERMINATION OF THIS LICENSE. Intel or the sublicensor may terminate this license

at any time if Licensee is in breach of any of its terms or conditions. Upon termination,

Licensee will immediately destroy or return to Intel all copies of the Soware.

THIRD PARTY BENEFICIARY. Intel is an intended beneciary of the End User License

Agreement and has the right to enforce all of its terms.

U.S. GOVERNMENT RESTRICTED RIGHTS. e Soware is a commercial item (as

dened in 48 C.F.R. 2.101) consisting of commercial computer soware and commercial

computer soware documentation (as those terms are used in 48 C.F.R. 12.212), consistent

with 48 C.F.R. 12.212 and 48 C.F.R 227.7202-1 through 227.7202-4. You will not provide

the Soware to the U.S. Government. Contractor or Manufacturer is Intel Corporation,

2200 Mission College Blvd., Santa Clara, CA 95054.

EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will

export/re-export the Soware, directly or indirectly, to any country for which the U.S.

Department of Commerce or any other agency or department of the U.S. Government

or the foreign government from where it is shipping requires an export license, or other

governmental approval, without rst obtaining any such required license or approval. In

the event the Soware is exported from the U.S.A. or re-exported from a foreign destina-

tion by Licensee, Licensee will ensure that the distribution and export/re-export or import

of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S.

Export Administration Regulations and the appropriate foreign government.

APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will

be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws

principles. e Parties to this Agreement exclude the application of the United Nations

Convention on Contracts for the International Sale of Goods (1980). e state and federal

courts sitting in Delaware, U.S.A. will have exclusive jurisdiction over any dispute arising

out of or relating to this Agreement. e Parties consent to personal jurisdiction and venue

in those courts. A Party that obtains a judgment against the other Party in the courts iden-

tied in this section may enforce that judgment in any court that has jurisdiction over the

Parties.

Licensee’s specic rights may vary from country to country.

1

English

H570 Steel Legend

Motherboard Layout

Intel

H570

DDR4_A2 (64 bit, 288-pin module)

DDR4_A1 (64 bit, 288-pin module)

DDR4_B2 (64 bit, 288-pin module)

DDR4_B1 (64 bit, 288-pin module)

USB 2.0

T: USB_1

B: USB_2

ATXPWR1

PCIE1

Top:

RJ-45

USB 3.2 Gen1

T: USB3_1

B: USB3_2

PCIE3

HDLED RESET

PLED PWRBTN

1

HD_AUDIO1

13

20

1

PS2

Keyboard

/Mouse

CMOS

Battery

PCIE2

16

10

1

M2_1

C 1

C 2

11

Top:

LINE IN

Center:

FRONT

Bottom:

MIC IN

1

M2_WIFI1

M2_WIFI_CT1

M2_3

C 6

C 5

C 4

HDMI1

T B1

1

2

PCIE5

TTT

TT

AUDIO

CODEC

1

14

23

4

CHA_FAN1/WP

CHA_FAN2/WP

CHA_FAN3/WP

56

12

CHA_FAN4/WP

1

18

26

11

25

28

1

7

8

SUPER

I/O

USB3_3_4

F_USB31_TC_1

RGB_LED2

ADDR_LED2

1

RoHS

ADDR_LED1RGB_LED1

USB_3_4 USB_5_6

CLRMOS1

SPK_PLED1 PANEL1

ATX12V2

ATX12V1

SPI_TPM_J1

SATA3_4

SATA3 _5

SATA3_2

SATA3_3

24 22

27

17

SATA3_0

SATA3_1

PCIE4

M2_2

C 7

C 8

TT

USB3_5_6

USB 3.2 Gen2

T:USB31_TA_1

B: USB31_TC_1

CPU_FAN2/WP

9

15

19

21

29

CPU_FAN1

3

D 1

P

2

English

No. Description

1 ATX 12V Power Connector (ATX12V1)

2 ATX 12V Power Connector (ATX12V2)

3 CPU Fan Connector (CPU_FAN1)

4 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)

5 2 x 288-pin DDR4 DIMM Slots (DDR4_A2, DDR4_B2)

6 CPU/Water Pump Fan Connector (CPU_FAN2/WP)

7 RGB LED Header (RGB_LED2)

8 Addressable LED Header (ADDR_LED2)

9 Chassis/Water Pump Fan Connector (CHA_FAN3/WP)

10 ATX Power Connector (ATXPWR1)

11 USB 3.2 Gen1 Header (USB3_3_4)

12 Chassis/Water Pump Fan Connector (CHA_FAN1/WP)

13 Front Panel Type C USB 3.2 Gen2x2 Header (F_USB31_TC_1)

14 USB 3.2 Gen1 Header (USB3_5_6)

15 SATA3 Connectors (SATA3_4)(Upper), (SATA3_5)(Lower)

16 SATA3 Connectors (SATA3_2)(Upper), (SATA3_3)(Lower)

17 SATA3 Connectors (SATA3_0)(Upper), (SATA3_1)(Lower)

18 Chassis/Water Pump Fan Connector (CHA_FAN4/WP)

19 System Panel Header (PANEL1)

20 Power LED and Speaker Header (SPK_PLED1)

21 SPI TPM Header (SPI_TPM_J1)

22 Clear CMOS Jumper (CLRMOS1)

23 USB 2.0 Header (USB_5_6)

24 USB 2.0 Header (USB_3_4)

25 RGB LED Header (RGB_LED1)

26 Addressable LED Header (ADDR_LED1)

27 Front Panel Audio Header (HD_AUDIO1)

28 underbolt AIC Connector (TB1)

29 Chassis/Water Pump Fan Connector (CHA_FAN2/WP)

3

English

H570 Steel Legend

I/O Panel

1

11 7

10

3

8

2

6

5

4

9

* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications.

Activity / Link LED Speed LED

Status Description Status Description

O No Link O 10Mbps connection

Blinking Data Activity Orange 100Mbps/1Gbps

connection

On Link Green 2.5Gbps connection

** Function of the Audio Ports in 7.1-channel Conguration:

Port Function

Light Blue (Rear panel) Rear Speaker Out

Lime (Rear panel) Front Speaker Out

Pink (Rear panel) Central /Subwoofer Speaker Out

Lime (Front panel) Side Speaker Out

No. Description No. Description

1 USB 2.0 Ports (USB_1_2) 7 USB 3.2 Gen1 Ports (USB3_1_2)

2USB 3.2 Gen2 Type-A Port

(USB31_TA_1) 8USB 3.2 Gen2 Type-C Port

(USB31_TC_1)

3 2.5G LAN RJ-45 Port* 9 DisplayPort 1.4

4 Line In (Light Blue)** 10 HDMI Port

5 Front Speaker (Lime)** 11 PS/2 Mouse/Keyboard Port

6 Microphone (Pink)**

ACT/LINK LED

SPEED LED

LAN Port

4

English

Chapter 1 Introduction

ank you for purchasing ASRock H570 Steel Legend motherboard, a reliable

motherboard produced under ASRock’s consistently stringent quality control.

It delivers excellent performance with robust design conforming to ASRock’s

commitment to quality and endurance.

1.1 Package Contents

• ASRock H570 Steel Legend Motherboard (ATX Form Factor)

• ASRock H570 Steel Legend Quick Installation Guide

• ASRock H570 Steel Legend Support CD

• 2 x Serial ATA (SATA) Data Cables (Optional)

• 4 x Screws for M.2 Sockets (Optional)

• 1 x Stando for M.2 Socket (Optional)

• 1 x I/O Panel Shield

Because the motherboard specications and the BIOS soware might be updated, the

content of this documentation will be subject to change without notice. In case any

modications of this documentation occur, the updated version will be available on

ASRock’s website without further notice. If you require technical support related to

this motherboard, please visit our website for specic information about the model

you are using. You may nd the latest VGA cards and CPU support list on ASRock’s

website as well. ASRock website http://www.asrock.com.

5

English

H570 Steel Legend

1.2 Specications

Platform • ATX Form Factor

• Solid Capacitor design

CPU • Supports 10th Gen Intel® CoreTM Processors and 11th Gen

Intel® CoreTM Processors (LGA1200)

• Digi Power design

• 8 Power Phase design

• Supports Intel® Turbo Boost Max 3.0 Technology

Chipset • Intel® H570

Memory • Dual Channel DDR4 Memory Technology

• 4 x DDR4 DIMM Slots

• 11th Gen Intel® CoreTM Processors support DDR4 non-ECC,

un-buered memory up to 4800+(OC)*

• 10th Gen Intel® CoreTM Processors support DDR4 non-ECC,

un-buered memory up to 4666+(OC)*

* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 3200;

CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666.

* 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933; CoreTM

(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.

* Please refer to Memory Support List on ASRock's website for

more information. (http://www.asrock.com/)

• Supports ECC UDIMM memory modules (operate in non-

ECC mode)

• Max. capacity of system memory: 128GB

• Supports Intel® Extreme Memory Prole (XMP) 2.0

Expansion

Slot

11th Gen Intel® CoreTM Processors

• 2 x PCI Express x16 Slots (PCIE1/PCIE3: single at Gen4x16

(PCIE1); dual at Gen4x16 (PCIE1) / Gen3x4 (PCIE3))*

10th Gen Intel® CoreTM Processors

• 2 x PCI Express x16 Slots (PCIE1/PCIE3: single at Gen3x16

(PCIE1); dual at Gen3x16 (PCIE1) / Gen3x4 (PCIE3))*

* Supports NVMe SSD as boot disks

6

English

• 3 x PCI Express 3.0 x1 Slots

• Supports AMD Quad CrossFireXTM and CrossFireXTM

• 1 x M.2 Socket (Key E), supports type 2230 WiFi/BT module

and Intel® CNVi (Integrated WiFi/BT)

Graphics * Intel® UHD Graphics Built-in Visuals and the VGA outputs can

be supported only with processors which are GPU integrated.

• 11th Gen Intel® CoreTM Processors support Intel® Xe Graphics

Architecture (Gen 12). 10th Gen Intel® CoreTM Processors

support Gen 9 Graphics

• Graphics, Media & Compute: Microso DirectX 12, OpenGL

4.5, Intel® Built In Visuals, Intel® Quick Sync Video, Hybrid /

Switchable Graphics, OpenCL 2.1

• Display & Content Security: Rec. 2020 (Wide Color Gamut),

Microso PlayReady 3.0, UHD/HDR Blu-ray Disc

• Dual graphics output: support HDMI and DisplayPort 1.4

ports by independent display controllers

• Supports HDMI 2.0 with max. resolution up to 4K x 2K

(4096x2160) @ 60Hz

• Supports DisplayPort 1.4 with max. resolution up to 4K x 2K

(4096x2304) @ 60Hz

• Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and

HBR (High Bit Rate Audio) with HDMI 2.0 Port

(Compliant HDMI monitor is required)

• Supports HDCP 2.3 with HDMI 2.0 and DisplayPort 1.4

Ports

• Supports 4K Ultra HD (UHD) playback with HDMI 2.0 and

DisplayPort 1.4 Ports

* 11th Gen Intel® CoreTM Processors support HDMI 2.0. 10th Gen

Intel® CoreTM Processors support HDMI 1.4.

Audio • 7.1 CH HD Audio (Realtek ALC897 Audio Codec)

• Supports Surge Protection

• Nahimic Audio

7

English

H570 Steel Legend

LAN • 2.5 Gigabit LAN 10/100/1000/2500 Mb/s

• Dragon RTL8125BG

• Supports Dragon 2.5G LAN Soware

- Smart Auto Adjust Bandwidth Control

- Visual User Friendly UI

- Visual Network Usage Statistics

- Optimized Default Setting for Game, Browser, and

Streaming Modes

- User Customized Priority Control

• Supports Wake-On-LAN

• Supports Lightning/ESD Protection

• Supports Energy Ecient Ethernet 802.3az

• Supports PXE

Rear Panel

I/O

• 1 x PS/2 Mouse/Keyboard Port

• 1 x HDMI Port

• 1 x DisplayPort 1.4

• 1 x USB 3.2 Gen2 Type-A Port (10 Gb/s) (ReDriver) (Supports

ESD Protection)

• 1 x USB 3.2 Gen2 Type-C Port (10 Gb/s) (ReDriver) (Supports

ESD Protection)

• 2 x USB 3.2 Gen1 Ports (Supports ESD Protection)

• 2 x USB 2.0 Ports (Supports ESD Protection)

• 1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED

LED)

• HD Audio Jacks: Line in / Front Speaker / Microphone

Storage • 6 x SATA3 6.0 Gb/s Connectors, support RAID (RAID 0,

RAID 1, RAID 5, RAID 10, Intel Rapid Storage Technology

18), NCQ, AHCI and Hot Plug*

* If M2_2 is occupied by a SATA-type M.2 device, SATA3_1 will

be disabled.

* If M2_2 is occupied by a PCIe-type M.2 device, SATA3_0 will

be disabled.

* If M2_3 is occupied by a SATA-type M.2 device, SATA3_2 will

be disabled.

8

English

• 1 x Hyper M.2 Socket (M2_1), supports M Key type

2260/2280 M.2 PCI Express module up to Gen4x4 (64 Gb/s)

(Only supported with 11th Gen Intel® CoreTM Processors)**

• 1 x Ultra M.2 Socket (M2_2), supports M Key type 2260/2280

M.2 SATA3 6.0 Gb/s module and M.2 PCI Express module

up to Gen3 x4 (32 Gb/s)**

• 1 x Ultra M.2 Socket (M2_3), supports M Key type

2260/2280/22110 M.2 SATA3 6.0 Gb/s module and M.2 PCI

Express module up to Gen3 x4 (32 Gb/s)**

** Supports Intel® OptaneTM Technology

** Supports NVMe SSD as boot disks

** Supports ASRock U.2 Kit

Connector • 1 x SPI TPM Header

• 1 x Power LED and Speaker Header

• 2 x RGB LED Headers

* Support in total up to 12V/3A, 36W LED Strip

• 2 x Addressable LED Headers

* Support in total up to 5V/3A, 15W LED Strip

• 1 x CPU Fan Connector (4-pin)

* e CPU Fan Connector supports the CPU fan of maximum

1A (12W) fan power.

• 1 x CPU/Water Pump Fan Connector (4-pin) (Smart Fan

Speed Control)

* e CPU/Water Pump Fan supports the water cooler fan of

maximum 2A (24W) fan power.

• 4 x Chassis/Water Pump Fan Connectors (4-pin) (Smart Fan

Speed Control)

* e Chassis/Water Pump Fan supports the water cooler fan of

maximum 2A (24W) fan power.

* CPU_FAN2/WP, CHA_FAN1/WP, CHA_FAN2/WP, CHA_

FAN3/WP and CHA_FAN4/WP can auto detect if 3-pin or 4-pin

fan is in use.

• 1 x 24 pin ATX Power Connector

• 1 x 8 pin 12V Power Connector (Hi-Density Power Connec-

tor)

• 1 x 4 pin 12V Power Connector (Hi-Density Power Connec-

tor)

9

English

H570 Steel Legend

Please realize that there is a certain risk involved with overclocking, including

adjusting the setting in the BIOS, applying Untied Overclocking Technology, or using

third-party overclocking tools. Overclocking may aect your system’s stability, or

even cause damage to the components and devices of your system. It should be done

at your own risk and expense. We are not responsible for possible damage caused by

overclocking.

* For detailed product information, please visit our website: http://www.asrock.com

• 1 x Front Panel Audio Connector

• 1 x underbolt AIC Connector (5-pin) (Supports ASRock

underbolt 4 AIC Card)

• 2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports

ESD Protection)

• 2 x USB 3.2 Gen1 Headers (Support 4 USB 3.2 Gen1 ports)

(ASMedia ASM1074 hub) (Supports ESD Protection)

• 1 x Front Panel Type C USB 3.2 Gen2x2 Header (20 Gb/s)

(Supports ESD Protection)

BIOS

Feature

• AMI UEFI Legal BIOS with multilingual GUI support

• ACPI 6.0 Compliant wake up events

• SMBIOS 2.7 Support

• CPU Core/Cache, CPU GT, DRAM, VCCIO, VCCSA,

VCCST, VCCIN AUX, VPPM Voltage Multi-adjustment

Hardware

Monitor

• Fan Tachometer: CPU, CPU/Water Pump, Chassis/Water

Pump Fans

• Quiet Fan (Auto adjust chassis fan speed by CPU tempera-

ture): CPU, CPU/Water Pump, Chassis/Water Pump Fans

• Fan Multi-Speed Control: CPU, CPU/Water Pump, Chassis/

Water Pump Fans

• Voltage monitoring: CPU Vcore, PCH, DRAM, VCCIO,

VPPM, VCCSA, CPU PLL, +12V, +5V, +3.3V

OS • Microso® Windows® 10 64-bit

Certica-

tions

• FCC, CE

• ErP/EuP ready (ErP/EuP ready power supply is required)

10

English

is is an ATX form factor motherboard. Before you install the motherboard, study

the conguration of your chassis to ensure that the motherboard ts into it.

Pre-installation Precautions

Take note of the following precautions before you install motherboard components

or change any motherboard settings.

• Make sure to unplug the power cord before installing or removing the motherboard

components. Failure to do so may cause physical injuries and damages to motherboard

components.

• In order to avoid damage from static electricity to the motherboard’s components,

NEVER place your motherboard directly on a carpet. Also remember to use a grounded

wrist strap or touch a safety grounded object before you handle the components.

• Hold components by the edges and do not touch the ICs.

• Whenever you uninstall any components, place them on a grounded anti-static pad or

in the bag that comes with the components.

• When placing screws to secure the motherboard to the chassis, please do not over-

tighten the screws! Doing so may damage the motherboard.

Chapter 2 Installation

11

English

H570 Steel Legend

2.1 Installing the CPU

1. Before you insert the 1200-Pin CPU into the socket, please check if the PnP cap is on the

socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not

force to insert the CPU into the socket if above situation is found. Otherwise, the CPU

will be seriously damaged.

2. Unplug all power cables before installing the CPU.

1

2

A

B

12

English

4

5

3

13

English

H570 Steel Legend

Please save and replace the cover if the processor is removed. e cover must be placed if

you wish to return the motherboard for aer service.

14

English

2.2 Installing the CPU Fan and Heatsink

1 2

CPU_FAN

15

English

H570 Steel Legend

2.3 Installing Memory Modules (DIMM)

is motherboard provides four 288-pin DDR4 (Double Data Rate 4) DIMM slots,

and supports Dual Channel Memory Technology.

Dual Channel Memory Conguration

e DIMM only ts in one correct orientation. It will cause permanent damage to

the motherboard and the DIMM if you force the DIMM into the slot at incorrect

orientation.

Priority DDR4_A1 DDR4_A2 DDR4_B1 DDR4_B2

1Populated Populated

2Populated Populated Populated Populated

1. For dual channel conguration, you always need to install identical (the same

brand, speed, size and chip-type) DDR4 DIMM pairs.

2. It is unable to activate Dual Channel Memory Technology with only one or three

memory module installed.

3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4

slot; otherwise, this motherboard and DIMM may be damaged.

16

English

1

2

3

La pagina si sta caricando...

ASROCK H570 Istruzioni per l'uso

ASROCK H570 Istruzioni per l'uso

in altre lingue

Documenti correlati

Altri documenti