EPOX EP-V370Y Manuale utente

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TRADEMARK
All products and company names are trademarks or
registered trademarks of their respective holders.
These specifications are subject to change without
notice.
Manual Revision 1.0
November 18, 1998
EP-BX3EP-BX3
EP-BX3EP-BX3
EP-BX3
A PentiumA Pentium
A PentiumA Pentium
A Pentium
®®
®®
®
II or Deschutes II or Deschutes
II or Deschutes II or Deschutes
II or Deschutes
Slot1 Processor based AGPSlot1 Processor based AGP
Slot1 Processor based AGPSlot1 Processor based AGP
Slot1 Processor based AGP
mainboard (100/66MHz)mainboard (100/66MHz)
mainboard (100/66MHz)mainboard (100/66MHz)
mainboard (100/66MHz)
EP-BX3
EP-BX3
Technical Support Services
If you need additional information, help during installation or normal use of this
product, please contact your retailer. If your retailer can not help, you may E-Mail us
with any questions at the following address [email protected]
Record your serial number before installing your EP-BX3 mainboard. (the serial
number is located near the ISA slots at the edge of the board)
EP-BX3 serial number:
__________________________
BIOS Upgrades
Please use either our Web Site or BBS for current BIOS Upgrades.
Internet Access
http://www.epox.com
http://www.epox.com.tw
Modem Access
31-182-618451 (The Netherlands)
You can access this number via a Hayes-compatible modem with a 2,400 to
28,800 baud rate. The following setup format is required:
8 Data Bits, No Parity, 1 Stop Bit.
If your modem is unable to connect at higher baud rates, try connecting at
2,400 baud before contacting Technical Support.
Thank you for using EPoX mainboards!
© Copyright 1998 EPoX Computer Company. All rights reserved.
EP-BX3
User Notice
No part of this product, including the product and software may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language
in any form by any means without the express written permission of EPoX Computer
Company (hereinafter referred to as EPoX) except documentation kept by the
purchaser for backup purposes.
EPoX provides this manual “as is” without warranty of any kind, either express or
implied, including but not limited to the implied warranties or conditions of merchant-
ability or fitness for a particular purpose. In no event shall EPoX be liable for any
loss or profits, loss of business, loss of use or data, interruption of business or for
indirect, special incidental, or consequential damages of any kind, even if EPoX has
been advised of the possibility of such damages arising from any defect or error in
the manual or product. EPoX may review this manual from time to time without
notice. For updated BIOS, drivers, or product release information you may visit
EPoX’s home page at: http://www.epox.com
Products mentioned in this manual are mentioned for identification purposes only.
Product names appearing in this manual may or may not be registered trademarks or
copyrights of their respective companies.
The product name and revision number are both printed on the mainboard
itself.
Handling Procedures
Static electricity can severely damage your equipment. Handle the EP-BX3
and any other device in your system with care and avoid unneccessary contact with
system components on the mainboard.
Always work on an antistatic surface to avoid possible damage to the motherboard
from static discharge.
We assume no responsibility for any damage to the EP-BX3 mainboard that results
from failure to follow installation instructions or failure to observe safety precautions.
CAUTION
The EP-BX3 mainboard is subject to
damage by static electricity. Always
observe the handling procedures.
EP-BX3
Table of Contents
Section 1 Introduction
Components Checklist .................................... 1-1
Overview
Pentium II or Deschutes Processor.................. 1-2
S.E.C. Cartridge Terminology ......................... 1-3
Accelerated Graphics Port .............................. 1-4
Hardware Monitoring ..................................... 1-4
EP-BX3 Form-Factor .................................... 1-6
I/O Shield Connector...................................... 1-7
Power-On/Off (Remote) ................................. 1-7
System Block Diagram ................................... 1-8
Section 2 Features
EP-BX3 Features ........................................... 2-1
Section 3 Installation
EP-BX3 Detailed Layout ................................ 3-2
Easy Installation Procedure
Configure Jumpers .......................................... 3-3
System Memory Configuration ........................ 3-5
Installing a Pentium
®
II Processor .................... 3-9
Device Connectors ......................................... 3-10
External Modem Ring-in Power ON and
Keyboard Power ON Function (KBPO) ........ 3-12
Section 4 Award BIOS Setup
BIOS Instructions ........................................... 4-1
Standard CMOS Setup .................................. 4-2
BIOS Features Setup ..................................... 4-3
Chipset Features Setup ................................... 4-8
EP-BX3
Power Management Setup .............................. 4-12
PNP/PCI Configuration .................................. 4-16
Load Setup Defaults ....................................... 4-18
Integrated Peripherals ..................................... 4-18
Change Supervisor or User Password ............. 4-23
IDE HDD Auto Detection............................... 4-24
HDD Low Level Format................................. 4-26
Save & Exit Setup .......................................... 4-26
Exit Without Saving......................................... 4-26
Appendix
Appendix A
Memory Map ................................................. A-1
I/O Map......................................................... A-1
Timer & DMA Channels Map......................... A-2
Interrupt Map ................................................. A-2
RTC & CMOS RAM Map ............................ A-3
Appendix B
POST Codes ................................................. A-5
Unexpected Errors ......................................... A-8
Appendix C
Load Setup Defaults ....................................... A-9
Appendix D
CPU Clock Frequency Selection In BIOS Setting
...................................................................... A-10
IntroductionEP-BX3
Page 1-1
Section 1
INTRODUCTION
Components Checklist
üü
üü
ü A. (1) EP-BX3 mainboard
üü
üü
ü B. (1) EP-BX3 users manual
üü
üü
ü C. (1) Floppy ribbon cable
üü
üü
ü D. (1) Hard drive ribbon cables
üü
üü
ü E. (1) Foldable Retention Module
F. (1) Heatsink Support Unit (Optional)
G. (1) PS/2 to AT keyboard connector adapter (optional)
üü
üü
ü H. (1) Bus master drivers
(1) USDM
USERS
MANUAL
EP-BX3
B
A
G
C
D
F
Top Half
Bottom Half
E
25 26
H
or
Introduction EP-BX3
Page 1-2
Overview
Pentium II or Deschutes Processor
The Pentium
®
II or Deschutes Processor (The Deschutes Processor as 300/
100MHz, 350/100MHz, 400/100MHz and 450/100MHz speed with 512K-L2 cache
Versions.) is the follow-on to the Pentium
®
Processor. The Pentium
®
II or
Deschutes Processor, like the Pentium
®
Pro processor, implements a Dynamic
Execution micro-architecture -- a unique combination of multiple branch prediction,
data flow analysis, and speculative execution. This enables the Pentium
®
II Proces-
sor to deliver higher performance than the Pentium
®
processor, while maintaining
binary compatibility with all previous Intel architecture processors.
A significant feature of the Pentium
®
II or Deschutes Processor, from a system
perspective, is the built-in direct multiprocessing support. In order to achieve
multiprocessing, and maintain the memory and I/O bandwidth to support it, new
system designs are needed. For systems with dual processors, it is important to
consider the additional power burdens and signal integrity issues of supporting
multiple loads on a high speed bus. The Pentium
®
II or Deschutes Processor card
supports both uni-processor and dual processor implementations.
The Pentium
®
II or Deschutes Processor utilizes Single Edge Contact (S.E.C.)
(Figure 1) cartridge packaging technology. The S.E.C. cartridge allows the L2 cache
to remain tightly coupled to the processor, while maintaining flexibility when imple-
menting high performance processors into OEM systems. The second level cache is
performance optimized and tested at the cartridge level. The S.E.C. cartridge utilizes
surface mounted core components and a printed circuit board with an edge finger
connection. The S.E.C. cartridge package introduced on the Pentium
®
II Processor
will also be used in future Slot 1 processors.
The S.E.C. cartridge has the following features: a thermal plate, a cover and a PCB
with an edge finger connection. The thermal plate allows standardized heatsink
attachment or customized thermal solutions. The thermal plate enables a reusable
heatsink to minimize fit issues for serviceability, upgradeability and replacement. The
full enclosure also protects the surface mount components. The edge finger connec-
tion maintains socketabilty for system configuration. The edge finger connector is
denoted as ‘Slot 1 connector’ in this and other documentation.
The entire enclosed product is called the Pentium
®
II or Deschutes Processor. The
IntroductionEP-BX3
Page 1-3
packaging technology and each of the physical elements of the product are referred
to using accurate technical descriptions. This allows clear reference to the products
as just a processor. This is the model used in past packaging technologies like PGA,
TCP, PQFP, DIP, etc.
S.E.C. Cartridge Terminology
Pentium
®
II or Deschutes Processor
The new enclosed card packaging technology is called a “Single Edge
Contact cartridge.” This is similar to previous names for packaging
technology such as PGA or TCP.
Processor card
The green PCB (with or without components on it)
Processor core
The silicon on the PLGA package on the PCB
Cover
The plastic cover on the opposite side from the thermal plate.
Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium
®
Pro
processor uses Socket 8.
Retention mechanism
Formerly ‘retention module’ the dual posts, etc. that holds the cartridge
in place.
Thermal plate
The heatsink attachment plate.
Heat sink supports
Figure 1: Pentium
®
II or Deschutes
Processor CPU with S.E.C. Cartridge
Processor
Printed Circuit Board
Thermal Plate
Cover
The support pieces that are
mounted on the mainboard
to provide added support for
heatsinks.
The L2 cache (TagRAM, PBSRAM)
components keep standard industry
names.
The Pentium
®
II or Deschutes Processor
is the first product to utilize the S.E.C.
cartridge technology and Slot 1
connector. Unless otherwise noted, any
references to “Pentium
®
II Processor,”
Introduction EP-BX3
Page 1-4
“Pentium
®
II or Deschutes Processor/Slot 1 processor” or “Deschutes Processor”
will apply to both the Pentium
®
II Processor desktop processors.
Accelerated Graphics Port
(AGP or A.G.P.)
Typically, 3D graphics rendering requires a tremendous amount of memory, and
demands ever increasing throughput speed as well. As 3D products for the personal
computer become more and more popular, these demands will only increase. This
will cause a rise in costs for both end users and manufacturers. Lowering these
costs as well as improving performance is the primary motivation behind AGP. By
providing a massive increase in the bandwidth available between the video card and
the processor, it will assist in relieving some of these pressures for quite sometime.
Hardware Monitoring
Hardware monitoring allows you to monitor various aspects of your systems opera-
tions and status. The features include CPU temperature, voltage and RPM of fan.
IntroductionEP-BX3
Page 1-5
Page Right Blank
Introduction EP-BX3
Page 1-6
EP-BX3 Form-Factor
The EP-BX3 is designed with ATX form factor - the latest industry standard of
chassis. The ATX form factor is essentially a Baby-AT baseboard rotated 90
degrees within the chassis enclosure and a new mounting configuration for the power
supply. With these changes the processor is relocated away from the expansion slots,
allowing them all to hold full length add-in cards. ATX defines a double height
aperture to the rear of the chassis which can be used to host a wide range of
onboard I/O. Only the size and position of this aperture is defined, allowing PC
manufacturers to add new I/O features (e.g.; TV input, TV output, joystick, modem,
LAN, audio, etc.) to systems. This will help systems integrators differentiate their
products in the marketplace, and better meet your needs.
By integrating more I/O down onto the board and better positioning the hard
drive and floppy connectors material cost of cables and add-in cards is reduced.
By reducing the number of cables and components in the system, manufacturing
time and inventory holding costs are reduced and reliability will increase.
By using an optimized power supply, it's possible to reduce cooling costs and
lower acoustical noise. An ATX power supply, which has a side-mounted fan,
allows direct cooling of the processor and add-in cards making a secondary fan
or active heatsink unnecessary in most system applications.
Full length
slots
Expandable I/O
5 1/4"
Bay
3 1/2"
Bay
Figure 2: Summary of ATX chassis features
CPU located near
Power Supply
Single chassis
fan for
system
ATX
Power
Sup-
ply
ATX power
connector
Floppy / IDE
connectors
close to
peripheral
bays
25 26
IntroductionEP-BX3
Page 1-7
I/O Shield Connector
The EP-BX3 is equipped with an I/O back panel. Please use the appropriate I/O
shield (figure 3).
ATX
POWER SUPPLY
EP-BX3 Board
Power-On/Off (Remote)
The EP-BX3 has a single 20-pin connector for ATX power supplies. For ATX
power supplies that support the Remote On/Off feature, this should be connected to
the systems front panel for system Power On/Off button. The systems power On/
Off button should be a momentary button that is normally open.
The EP-BX3 has been designed with “Soft Off" functions. You can turn Off the
system from one of two sources: The first is the front panel Power On/Off button,
and the other is the "Soft Off" function (coming from the EP-BX3’s onboard circuit
controller) that can be controlled by the operating system. Windows 95/98 will
control this when the user clicks that they are ready to Shutdown the system.
Figure 3:
EP-BX3
I/O back
panel layout
Case (chassis) Power
ON/OFF button
PS/2 Mouse
PS/2 Keyboard
Parallel Port
COM1
USB
COM2
Figure 4: Simple ATX Power
ON/OFF Controller
J3
25 26
Introduction EP-BX3
Page 1-8
Figure 5: System Block Diagram
System Block Diagram
Pentium II or
Deschutes
Processor
PAC
PCI Bridge
and memory
controller
443BX
PllX4E
I/O Bridge
100/66MHz
100/66MHz
66MHz
FeaturesEP-BX3
Page 2-1
Section 2
FEATURES
EP-BX3 Features:
EP-BX3 is based on the Pentium
®
II or Deschutes Processor operating at 233
~ 333MHz (66MHz) or 300 ~ 450MHz (100MHz) on Slot 1. The board is
configured by an Easy-Setting-Daul-Jumper (E.S.D.J.) to match your CPU
clock speed.
Designed with Intel’s 82443 BX AGPset.
Supports up to 768 Mega of DRAM (minimum of 16 MB) on board, You can
use 168-pin DIMM x 3. It will automatically detect Extended Data Output
(EDO) DRAM at 66MHz only or Synchronous DRAM memory (SDRAM) at
66MHz or 100MHz (please see Section 3-2).
EP-BX3 will support Error Checking and Correcting (ECC) when using paritys
DRAM memory modules. This will detect multiple bit errors and correct 1-bit
memory errors.
Supports (2) 16 bit ISA slots, (5) 32 bit PCI slots, (1) AGP slot and provides
(2) independent high performance PCI IDE interfaces capable of supporting
PIO Mode 3/4 and Ultra DMA 33 devices. The EP-BX3 supports (5) PCI
Bus Master slots and a jumperless PCI INT# control scheme which reduces
configuration confusion when plugging in PCI card(s).
Supports ATAPI (e.g. CD-ROM) devices on both Primary and Secondary IDE
interfaces.
Designed with Winbond W83977TF Multi I/O: (1) floppy port, (1) parallel port
(EPP, ECP), and (2) serial ports (16550 Fast UART).
Note: Japanese “Floppy 3 mode” is also supported
Includes a PS/2 mouse connector.
Allows use of a PS/2 keyboard.
Features Award Plug & Play BIOS. With Flash Memory you can always
upgrade to the current BIOS as they are released. (http://www.epox.com
please visit our Technical Support section for the latest updates)
Features EP-BX3
Page 2-2
EP-BX3 utilizes a Lithium battery which provides environmental protection and
longer battery life.
Supports the Universal Serial Bus (USB) connector. The onboard PIIX4E chip
provides the means for connecting PC peripherals such as; keyboards,
joysticks, telephones, and modems.
Built-in ATX 20-pin power supply connector.
Software power-down when using Windows
®
95/98.
Supports ring-in feature (remote power-on through external modem, allows
system to be turned on remotely.
Resume by Alarm - Allows your system to turn on at a preselected time.
Power Loss Recovery - In the event of a power outtage your system will
automatically turn itself back on without user intervention.
Supports CPU Hardware sleep and SMM (System Management Mode).
Supports Desktop Management Interface (DMI) facilitating the management
of desktop computers, hardware and software components and peripherals,
whether they are stand-alone systems or linked into networks. (optional)
Supports Hot key, Any key or password Keyboard power ON function
(KBPO).
Supports USDM software to offer motherboard various status on Windows
®
95/98, or Windows
®
NT 4.0/5.0.
Supports the CPU, PWR and Chassis fan Auto stop in sleep mode.
Supports the System Power LED (PANEL) blinks in the sleep mode.
Built-in WOL (Wake On Lan) Connector.
Built-in SB-LINK Header for Creative Blaster
®
AWE64D PCI Bus Sound
Card.
InstallationEP-BX3
Page 3-1
Section 3
INSTALLATION
Installation EP-BX3
Page 3-2
Figure 1
EP-BX3 Detailed Layout
AGP SLOT
PCI Slot #1
PCI Slot #2
ISA Slot #1
ISA Slot #2
Battery
ATX Power Input
Winbond
83977
I/Oset
USB 1
(Top)
Mouse
(Top)
USB 0
(Bottom)
Keyboard
(Bottom)
IDE2
Secondary IDE
IDE1
FDD1
CPU Cartridge SLOT 1
J7:WOL
DIMM 2
DIMM 1
Bank 0
Bank 1
DIMM 3
Bank 2
Flash Memory
for BIOS
J5
PCI Slot #3
PCI Slot #4
PCI Slot #5
COM 1COM 2COM 2
USB
PS/2
ESDJ
JP3
124MHz
112MHz
103MHz
100MHz
66MHz
AUTO
5.5X
5X
4.5X
4X
3.5X
3X
1 2
25 26
133MHz
Parallel Port
J8
SB_Link
J6
CHASSIS FAN
POWER
FAN
JP13
JP1
1
POWER_ON
1
J3
IR CONN.
J2
RESET
SPK
KEYLOCK
+
+
5
1
CPU FAN
J4
InstallationEP-BX3
Page 3-3
Easy Installation Procedure
Easy Installation Procedure
The following must be completed before powering on your new system:
3-1. Configure Jumpers to match your hardware
3-2. Install memory chips
3-3. Install Pentium II or Deschutes Processor
3-4. Device Connectors
Section 3-1
Configure Jumpers
We design this mainboard with the an ESDJ to make your install fast and easy.
The following will describe all of the ESDJ that you are required to set before moving
on to step 3-2.
Note: The ESDJ as depicted as shown (Figure 1) in their correct physical
orientation.
JP13
(Default)
Keyboard Power-ON function (refer the section 3-5)
JP13 = 1-2 - Enabled
= 2-3 - Disabled
1
3
J7 WOL (Wakup On Lan) Connector
Reserved for NIC (Network Interface Card) to
Wake the System.
JP1 = 1-2 - Run Mode (Default)
= 2-3 - Clear CM OS (momentarily)
JP1 CMOS Clear
1
3
J8 SB-LINK Header
Reserved for Creative SB-LINK (Sound Blaster
LINK ) with the Sound Blaster AWE64D PCI
Sound Card to Compatible DOS games and
Multimedia applications.
TM
TM
Installation EP-BX3
Page 3-4
Note: Based on the implementation of Intel 440BX PCIset, EP-BX3 is able to
provide two host bus frequencies -- either 66 or 100MHz for Slot1 processor and
memory operating. The default is set at 100MHz once Pentium
®
II processor to
be mounted onto this mainboard. However, no matter what kind of Slot1 proces-
sor you installed, it should come with right memory modules for normal and stable
operation. For example, if you install a Deschutes processor, you should use the
SDRAM module with 100MHz based(or above) to match the CPU speed.
Furthermore, one thing you may need to bear in mind, before the CPU installation, it
is anyway our advice to use JP3 and set up right speed of Slot1 processor at any
time.
*
*
*
*
*
**
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EPOX EP-V370Y Manuale utente

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