YASKAWA VIPA System SLIO Manuale utente

CPU | 013-CCF0R00 | Manual

HB300 | CPU | 013-CCF0R00 | en | 19-30

VIPA System SLIO

SPEED7 CPU 013C

www.vipa.com/en/service-support/manuals

013-CCF0R0_000_CPU 013C,7,EN

VIPA GmbH

Ohmstr

. 4

91074 Herzogenaurach

Telephone: 09132-744-0

Fax: 09132-744-1864

Email: [email protected]

Internet: www.vipa.com

Table of contents

1 General.................................................................................................................... 9

A GmbH ................................................................................. 9

1.2 About this manual........................................................................................... 10

1.3 Safety information........................................................................................... 11

2 Basics and mounting........................................................................................... 12

2.1 Safety information for users............................................................................ 12

2.2 System conception......................................................................................... 13

2.2.1 Overview...................................................................................................... 13

2.2.2 Components................................................................................................ 14

2.2.3 Accessories................................................................................................. 16

2.2.4 Hardware revision........................................................................................ 17

2.3 Dimensions..................................................................................................... 17

2.4 Mounting......................................................................................................... 20

2.4.1 Mounting CPU 01xC.................................................................................... 20

2.5 Wiring............................................................................................................. 22

2.5.1 Wiring CPU 01xC........................................................................................ 22

2.5.2 Wiring periphery modules............................................................................ 25

2.5.3 Wiring power modules................................................................................. 27

2.6 Demounting.................................................................................................... 32

2.6.1 Demounting CPU 01xC............................................................................... 32

2.6.2 Demounting periphery modules................................................................... 33

2.7 Trouble shooting - LEDs................................................................................. 37

2.8 Installation guidelines..................................................................................... 38

2.9 General data................................................................................................... 40

3 Hardware description........................................................................................... 42

3.1 Properties....................................................................................................... 42

3.2 Structure......................................................................................................... 43

3.2.1 Compact CPU.............................................................................................. 43

3.2.2 Interfaces..................................................................................................... 43

3.2.3 Memory management.................................................................................. 47

3.2.4 Slot for storage media................................................................................. 47

3.2.5 Buffering mechanisms................................................................................. 47

3.2.6 Operating mode switch................................................................................ 48

3.2.7 LEDs............................................................................................................ 49

3.3 Technical data................................................................................................. 53

4 Deployment CPU 013-CCF0R00.......................................................................... 66

4.1 Please note!.................................................................................................... 66

4.2 Assembly........................................................................................................ 66

4.3 Start-up behavior............................................................................................ 66

4.4 Addressing...................................................................................................... 67

4.4.1 Overview...................................................................................................... 67

4.4.2 Default address assignment of the I/O part................................................. 67

4.4.3 Addressing periphery modules.................................................................... 68

4.5 Hardware configuration - CPU........................................................................ 69

4.6 Hardware configuration - System SLIO modules........................................... 71

4.7 Hardware configuration - Ethernet PG/OP channel........................................ 72

4.7.1 Take IP address parameters in project........................................................

73

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4.8 Setting standard CPU parameters.................................................................. 78

4.8.1 Parameterization via Siemens CPU............................................................ 78

4.8.2 Parameter CPU........................................................................................... 78

4.8.3 Parameter for MPI/DP ................................................................................ 81

4.9 Setting VIPA specific CPU parameters........................................................... 82

4.9.1 Free Module Mapping.................................................................................. 85

4.9.2 Access settings............................................................................................ 90

4.10 Project transfer............................................................................................. 90

4.10.1 Transfer via MPI / optional PROFIBUS..................................................... 91

4.10.2 Transfer via Ethernet................................................................................. 92

4.10.3 Transfer via memory card.......................................................................... 93

4.11 Accessing the web server............................................................................. 93

4.11.1 Device web page CPU............................................................................... 94

4.12 Operating modes........................................................................................ 102

4.12.1 Overview.................................................................................................. 102

4.12.2 Function security..................................................................................... 104

4.13 Overall reset............................................................................................... 105

4.14 Firmware update......................................................................................... 106

4.14.1 Firmware update online........................................................................... 107

4.14.2 Firmware update via memory card.......................................................... 108

4.15 Reset to factory settings............................................................................. 110

4.16 Deployment storage media - VSD, VSC..................................................... 111

4.17 Extended know-how protection................................................................... 113

4.18 CMD - auto commands............................................................................... 114

4.19 Control and monitoring of variables with test functions.............................. 116

4.20 Diagnostic entries....................................................................................... 117

5 Deployment I/O periphery.................................................................................. 1

18

5.1 Overview....................................................................................................... 118

5.2 Address assignment..................................................................................... 119

5.3 Analog input.................................................................................................. 120

5.3.1 Properties.................................................................................................. 120

5.3.2 Analog value representation...................................................................... 120

5.3.3 Wiring........................................................................................................ 121

5.3.4 Parametrization......................................................................................... 122

5.4 Digital input................................................................................................... 123

5.4.1 Properties.................................................................................................. 123

5.4.2 Wiring........................................................................................................ 123

5.4.3 Parametrization......................................................................................... 124

5.4.4 Status indication........................................................................................ 125

5.5 Digital output................................................................................................. 126

5.5.1 Properties.................................................................................................. 126

5.5.2 Wiring........................................................................................................ 126

5.5.3 Parametrization......................................................................................... 127

5.5.4 Status indication........................................................................................ 127

5.6 Counting....................................................................................................... 128

5.6.1 Properties.................................................................................................. 128

5.6.2 Wiring........................................................................................................ 128

5.6.3 Proceeding................................................................................................ 130

5.6.4 Parametrization......................................................................................... 130

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5.6.5 Counter operating modes.......................................................................... 135

5.6.6 Counter - Additional functions................................................................... 142

5.6.7 Diagnostics and interrupt........................................................................... 148

5.7 Frequency measurement.............................................................................. 148

5.7.1 Properties.................................................................................................. 148

5.7.2 Wiring........................................................................................................ 149

5.7.3 Proceeding................................................................................................ 150

5.7.4 Parametrization......................................................................................... 150

5.7.5 Status indication........................................................................................ 152

5.8 Pulse width modulation - PWM..................................................................... 153

5.8.1 Properties.................................................................................................. 153

5.8.2 Wiring........................................................................................................ 153

5.8.3 Proceeding................................................................................................ 154

5.8.4 Parametrization......................................................................................... 154

5.8.5 Status indication........................................................................................ 156

5.9 Pulse train..................................................................................................... 157

5.9.1 Properties.................................................................................................. 157

5.9.2 Wiring........................................................................................................ 158

5.9.3 Proceeding................................................................................................ 158

5.9.4 Parametrization......................................................................................... 159

5.9.5 Status indication........................................................................................ 160

5.10 Diagnostic and interrupt.............................................................................. 161

5.10.1 Overview.................................................................................................. 161

5.10.2 Process interrupt..................................................................................... 161

5.10.3 Diagnostic interrupt.................................................................................. 163

6 Deployment PtP communication...................................................................... 170

6.1 Fast introduction........................................................................................... 170

6.2 Principle of the data transfer......................................................................... 171

6.3 Enable PtP functionality................................................................................ 172

6.4 Deployment of RS485 interface for PtP........................................................ 173

6.5 Parametrization............................................................................................ 174

6.5.1 FC/SFC 216 - SER_CFG - Parametrization PtP....................................... 174

6.6 Communication............................................................................................. 174

6.6.1 FC/SFC 217 - SER_SND - Send to PtP.................................................... 174

6.6.2 FC/SFC 218 - SER_RCV - Receive from PtP........................................... 175

6.7 Protocols and procedures............................................................................. 175

6.8 Modbus - Function codes ............................................................................ 179

7 Deployment OPC UA.......................................................................................... 183

7.1 General......................................................................................................... 183

7.2 Basics OPC UA............................................................................................ 184

7.2.1 OPC UA..................................................................................................... 184

7.2.2 Information modeling................................................................................. 185

7.2.3 OPC UA data types and their conversion

.................................................. 187

7.2.4 Integrated security concept....................................................................... 189

7.3 Activate OPC UA functionality...................................................................... 192

7.4 Usage in VIPA SPEED7 Studio.................................................................... 192

7.5 Usage in Siemens SIMATIC Manager.......................................................... 192

7.5.1 Installation OPC UA Configurator.............................................................. 193

7.5.2 Steps of the OPC UA configuration........................................................... 195

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7.6 Usage in Siemens TIA Portal....................................................................... 195

7.6.1 Installation OPC UA Configurator..............................................................

196

7.6.2 Steps of the OPC UA configuration........................................................... 198

7.7 Usage OPC UA Configurator........................................................................ 199

7.7.1 OPC UA Configurator................................................................................ 199

7.7.2

Project tree

............................................................................................ 200

7.7.3

Device properties .................................................................................. 201

7.7.4

Server settings - Connection ................................................................. 203

7.7.5

Server settings - Certificate ................................................................... 205

7.7.6

Data access .......................................................................................... 206

7.7.7

User management ................................................................................ 207

7.7.8

Role management ................................................................................. 208

7.7.9

Output

................................................................................................... 208

8 Deployment W

ebVisu - Web visualization........................................................ 209

8.1 WebVisu editor............................................................................................. 209

8.1.1 Working environment................................................................................. 210

8.1.2 Creating a WebVisu project....................................................................... 210

8.2 Activate WebVisu functionality..................................................................... 212

8.3 Start-up of the WebVisu project.................................................................... 212

8.4 Access to the WebVisu................................................................................. 213

8.4.1 Status of the WebVisu............................................................................... 213

9 Deployment PG/OP communication - productive........................................... 214

9.1 Basics - Industrial Ethernet in automation.................................................... 214

9.2 Basics - ISO/OSI reference model............................................................... 215

9.3 Basics - Terms.............................................................................................. 217

9.4 Basics - Protocols......................................................................................... 218

9.5 Basics - IP address and subnet.................................................................... 219

9.6 Fast introduction........................................................................................... 221

9.7 Hardware-Konfiguration................................................................................ 221

9.8 Configure Siemens S7 connections............................................................. 221

9.9 Configure Open Communication.................................................................. 227

10 Deployment PG/OP communication - PROFINET............................................ 230

10.1 Basics PROFINET...................................................................................... 230

10.2 PROFINET installation guidelines.............................................................. 232

10.3 Deployment as PROFINET IO controller.................................................... 233

10.3.1 Steps of configuration.............................................................................. 233

10.3.2 Commissioning and initialization............................................................. 234

10.3.3 Configuration PROFINET IO controller................................................... 235

10.3.4 Configuration PROFINET IO device........................................................ 237

10.4 Deployment as PROFINET I-Device.......................................................... 238

10.4.1 Steps of configuration.............................................................................. 238

10.4.2 Installing the GSDML file......................................................................... 239

10.4.3 Configuration as I-Device........................................................................ 239

10.4.4 Configuration in the higher-level IO controller......................................... 241

10.4.5 Error behavior and interrupts................................................................... 242

10.5 MRP............................................................................................................ 245

10.6 Topology..................................................................................................... 246

10.7 Device replacement without exchangeable medium/PG............................ 247

10.8 Commissioning and start-up behavior........................................................ 248

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10.9 PROFINET diagnostics.............................................................................. 249

10.9.1 Overview.................................................................................................. 249

10.9.2 Diagnostics with the configuration and engineering tool......................... 249

10.9.3 Diagnostics during runtime in the user program...................................... 250

10.9.4 Diagnostics via OB start information....................................................... 251

10.9.5 Diagnostics status indication via SSLs.................................................... 251

10.10 PROFINET system limits.......................................................................... 253

11 Option: Deployment PROFIBUS communication............................................ 254

11.1 Fast introduction......................................................................................... 254

11.2 PROFIBUS communication........................................................................ 255

11.3 Enable bus functionality via VSC................................................................ 256

11.4 Hardware configuration - CPU.................................................................... 256

11.5 Deployment as PROFIBUS DP master...................................................... 257

11.6 Deployment as PROFIBUS DP slave......................................................... 258

11.6.1 Diagnostic functions................................................................................. 260

11.7 PROFIBUS installation guidelines.............................................................. 263

11.8 Commissioning and Start-up behavior........................................................ 265

12 Configuration with VIPA SPEED7 Studio......................................................... 267

12.1 SPEED7 Studio

- Overview........................................................................ 267

12.2 SPEED7 Studio - Work environment.......................................................... 268

12.2.1 Project tree ............................................................................................. 270

12.2.2 Catalog ................................................................................................... 271

12.3 SPEED7 Studio - Hardware configuration - CPU....................................... 273

12.4 SPEED7 Studio - Hardware configuration - Ethernet PG/OP channel....... 274

12.5 SPEED7 Studio - Hardware configuration - I/O modules........................... 277

12.6 Deployment I/O periphery........................................................................... 277

12.6.1 Overview.................................................................................................. 277

12.6.2 Analog input............................................................................................. 278

12.6.3 Digital input.............................................................................................. 278

12.6.4 Digital output............................................................................................ 279

12.6.5 Counter.................................................................................................... 279

12.6.6 Frequency measurement......................................................................... 283

12.6.7 Pulse width modulation - PWM................................................................ 285

12.6.8 Pulse Train.............................................................................................. 287

12.7 Deployment OPC UA.................................................................................. 289

12.8 Deployment WebVisu - Web visualization.................................................. 289

12.9 SPEED7 Studio - Project transfer............................................................... 289

12.9.1 Transfer via MPI...................................................................................... 289

12.9.2 Transfer via Ethernet............................................................................... 291

12.9.3 Transfer via memory card........................................................................ 292

13 Configuration with TIA Portal............................................................................ 294

13.1 TIA Portal - Work environment .................................................................. 294

13.1.1 General.................................................................................................... 294

13.1.2 Work environment of the TIA Portal........................................................ 295

13.2 TIA Portal - Functional limitations............................................................... 296

13.3 TIA Portal - Hardware configuration - CPU................................................ 296

13.4 TIA Portal - Hardware configuration - Ethernet PG/OP channel................ 299

13.4.1 Take IP address parameters in project.................................................... 301

13.5 TIA Portal - Hardware configuration - I/O modules..................................... 304

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13.6 TIA Portal - Deployment PG/OP communication - PROFINET.................. 305

13.6.1 Deployment as PROFINET IO controller................................................. 305

13.6.2 Deployment as PROFINET I-Device....................................................... 310

13.7 TIA Portal - Option: Deployment PROFIBUS communication.................... 316

13.7.1 Fast introduction...................................................................................... 316

13.7.2 Activating bus functionality by means of a VSC...................................... 316

13.7.3 Hardware configuration - CPU................................................................. 316

13.7.4 Deployment as PROFIBUS DP master................................................... 316

13.7.5 Deployment as PROFIBUS DP slave...................................................... 318

13.8 Deployment OPC UA..................................................................................

319

13.9 TIA Portal - VIPA-Include library................................................................. 320

13.10 TIA Portal - Project transfer...................................................................... 320

13.10.1 Transfer via MPI.................................................................................... 321

13.10.2 Transfer via Ethernet............................................................................. 321

13.10.3 Transfer via memory card...................................................................... 322

Appendix............................................................................................................. 323

A System specific event IDs............................................................................... 325

B Integrated blocks............................................................................................. 377

C SSL partial list................................................................................................. 380

VIPA System SLIO

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HB300 | CPU | 013-CCF0R00 | en | 19-30 8

1 General

This document contains proprietary information of VIPA and is not to be disclosed or used

except in accordance with applicable agreements.

This material is protected by the copyright laws. It may not be reproduced, distributed, or

altered in any fashion by any entity (either internal or external to VIPA), except in accord-

ance with applicable agreements, contracts or licensing, without the express written con-

sent of VIPA and the business management owner of the material.

For permission to reproduce or distribute, please contact: VIPA, Gesellschaft für Visuali-

sierung und Prozessautomatisierung mbH Ohmstraße 4, D-91074 Herzogenaurach, Ger-

many

Tel.: +49 9132 744 -0

Fax.: +49 9132 744-1864

EMail: [email protected]

http://www.vipa.com

Every effort has been made to ensure that the information contained in

this document was complete and accurate at the time of publishing. Nev-

ertheless, the authors retain the right to modify the information.

This customer document describes all the hardware units and functions

known at the present time. Descriptions may be included for units which

are not present at the customer site. The exact scope of delivery is

described in the respective purchase contract.

Hereby, VIPA GmbH declares that the products and systems are in compliance with the

essential requirements and other relevant provisions. Conformity is indicated by the CE

marking af

fixed to the product.

For more information regarding CE marking and Declaration of Conformity (DoC), please

contact your local VIPA customer service organization.

VIPA, SLIO, System 100V, System 200V, System 300V, System 300S, System 400V,

System 500S and Commander Compact are registered trademarks of VIPA Gesellschaft

für Visualisierung und Prozessautomatisierung mbH.

SPEED7 is a registered trademark of profichip GmbH.

SIMATIC, STEP, SINEC, TIA Portal, S7-300, S7-400 and S7-1500 are registered trade-

marks of Siemens AG.

Microsoft and Windows are registered trademarks of Microsoft Inc., USA.

Portable Document Format (PDF) and Postscript are registered trademarks of Adobe

Systems, Inc.

All other trademarks, logos and service or product marks specified herein are owned by

their respective companies.

EC Conformity Declaration

Conformity Information

Trademarks

VIPA System SLIO

General

VIPA GmbH

HB300 | CPU | 013-CCF0R00 | en | 19-30

9

Contact your local VIPA Customer Service Organization representative if you wish to

report errors or questions regarding the contents of this document. If you are unable to

locate a customer service centre, contact VIP

A as follows:

VIPA GmbH, Ohmstraße 4, 91074 Herzogenaurach, Germany

Telefax: +49 9132 744-1204

EMail: [email protected]

Contact your local VIPA Customer Service Organization representative if you encounter

problems with the product or have questions regarding the product. If you are unable to

locate a customer service centre, contact VIPA as follows:

VIPA GmbH, Ohmstraße 4, 91074 Herzogenaurach, Germany

Tel.: +49 9132 744-1150 (Hotline)

EMail: [email protected]

1.2 About this manual

This manual describes the CPU 013-CCF0R00 of the System SLIO from VIPA. It contains

a description of the construction, project implementation and usage.

Product Order number as of state:

CPU-HW CPU-FW

CPU 013C 013-CCF0R00 01 V3.0.0

The manual is targeted at users who have a background in automation technology.

The manual consists of chapters. Every chapter provides a self-contained description of a

specific topic.

The following guides are available in the manual:

n An overall table of contents at the beginning of the manual

n References with page numbers

The manual is available in:

n printed form, on paper

n in electronic form as PDF-file (Adobe Acrobat Reader)

Important passages in the text are highlighted by following icons and headings:

DANGER!

Immediate or likely danger

. Personal injury is possible.

Information product sup-

port

Technical support

Objective and contents

Target audience

Structure of the manual

Guide to the document

Availability

Icons Headings

VIPA System SLIO

General

About this manual

HB300 | CPU | 013-CCF0R00 | en | 19-30 10

CAUTION!

Damages to property is likely if these warnings are not heeded.

Supplementary information and useful tips.

1.3 Safety information

The system is constructed and produced for:

n communication and process control

n general control and automation tasks

n industrial applications

n operation within the environmental conditions specified in the technical data

n installation into a cubicle

DANGER!

This device is not certified for applications in

–

in explosive environments (EX-zone)

The manual must be available to all personnel in the

n project design department

n installation department

n commissioning

n operation

CAUTION!

The following conditions must be met before using or commis-

sioning the components described in this manual:

– Hardware modifications to the process control system should only be

carried out when the system has been disconnected from power!

–

Installation and hardware modifications only by properly trained per-

sonnel.

– The national rules and regulations of the respective country must be

satisfied (installation, safety, EMC ...)

National rules and regulations apply to the disposal of the unit!

Applications conforming

with specifications

Documentation

Disposal

VIPA System SLIO

General

Safety information

HB300 | CPU | 013-CCF0R00 | en | 19-30 11

2 Basics and mounting

2.1 Safety information for users

VIPA modules make use of highly integrated components in MOS-Technology. These

components are extremely sensitive to over-voltages that can occur during electrostatic

discharges. The following symbol is attached to modules that can be destroyed by elec-

trostatic discharges.

The Symbol is located on the module, the module rack or on packing material and it indi-

cates the presence of electrostatic sensitive equipment. It is possible that electrostatic

sensitive equipment is destroyed by energies and voltages that are far less than the

human threshold of perception. These voltages can occur where persons do not dis-

charge themselves before handling electrostatic sensitive modules and they can damage

components thereby

, causing the module to become inoperable or unusable. Modules

that have been damaged by electrostatic discharges can fail after a temperature change,

mechanical shock or changes in the electrical load. Only the consequent implementation

of protection devices and meticulous attention to the applicable rules and regulations for

handling the respective equipment can prevent failures of electrostatic sensitive modules.

Modules must be shipped in the original packing material.

When you are conducting measurements on electrostatic sensitive modules you should

take the following precautions:

n Floating instruments must be discharged before use.

n Instruments must be grounded.

Modifying electrostatic sensitive modules you should only use soldering irons with

grounded tips.

CAUTION!

Personnel and instruments should be grounded when working on electro-

static sensitive modules.

Handling of electrostatic

sensitive modules

Shipping of modules

Measurements and altera-

tions on electrostatic sen-

sitive modules

VIPA System SLIO

Basics and mounting

Safety information for users

HB300 | CPU | 013-CCF0R00 | en | 19-30 12

2.2 System conception

2.2.1

Overview

System SLIO is a modular automation system for assembly on a 35mm mounting rail. By

means of the peripheral modules with 2, 4 or 8 channels this system may properly be

adapted matching to your automation tasks. The wiring complexity is low, because the

supply of the DC 24V power section is integrated to the backplane bus and defective

modules may be replaced with standing wiring. By deployment of the power modules in

contrasting colors within the system, further isolated areas may be defined for the DC

24V power section supply, respectively the electronic power supply may be extended with

2A.

VIPA System SLIO

Basics and mounting

System conception > Overview

HB300 | CPU | 013-CCF0R00 | en | 19-30 13

2.2.2 Components

n CPU (head module)

n Bus coupler (head module)

n Line extension

n Periphery modules

n Accessories

CAUTION!

Only modules of VIP

A may be combined. A mixed operation with third-

party modules is not allowed!

With this CPU 01xC, the CPU electronic, input/output components and power supply are

integrated to one casing. In addition, up to 64 periphery modules of the System SLIO can

be connected to the backplane bus. As head module via the integrated power supply

CPU electronic and the I/O components are power supplied as well as the electronic of

the connected periphery modules. T

o connect the power supply of the I/O components

and for DC 24V power supply of via backplane bus connected peripheral modules, the

CPU has removable connectors. By installing of up to 64 periphery modules at the back-

plane bus, these are electrically connected, this means these are assigned to the back-

plane bus, the electronic modules are power supplied and each periphery module is con-

nected to the DC 24V power section supply.

With this CPU 01x, the CPU electronic and power supply are integrated to one casing. As

head module, via the integrated power module for power supply, CPU electronic and the

electronic of the connected periphery modules are supplied. The DC 24 power section

supply for the linked periphery modules is established via a further connection of the

power module. By installing of up to 64 periphery modules at the backplane bus, these

are electrically connected, this means these are assigned to the backplane bus, the elec-

tronic modules are power supplied and each periphery module is connected to the DC

24V power section supply.

CAUTION!

CPU part and power module may not be separated!

Here you may only exchange the electronic module!

With a bus coupler bus interface and power module is integrated to one casing. With the

bus interface you get access to a subordinated bus system. As head module, via the inte-

grated power module for power supply

, bus interface and the electronic of the connected

periphery modules are supplied. The DC 24 power section supply for the linked periphery

modules is established via a further connection of the power module. By installing of up to

64 periphery modules at the bus coupler, these are electrically connected, this means

these are assigned to the backplane bus, the electronic modules are power supplied and

each periphery module is connected to the DC 24V power section supply.

CAUTION!

Bus interface and power module may not be separated!

Here you may only exchange the electronic module!

CPU 01xC

CPU 01x

Bus coupler

VIPA System SLIO

Basics and mounting

System conception > Components

HB300 | CPU | 013-CCF0R00 | en | 19-30 14

In the System SLIO there is the possibility to place up to 64 modules in on line. By means

of the line extension you can divide this line into several lines. Here you have to place a

line extension master at each end of a line and the subsequent line has to start with a line

extension slave. Master and slave are to be connected via a special connecting cable. In

this way

, you can divide a line on up to 5 lines. For each line extension the maximum

number of pluggable modules at the System SLIO bus is decreased by 1. To use the line

extension no special configuration is required.

Each periphery module consists of a terminal and an electronic module.

1 Terminal module

2 Electronic module

The terminal

module serves to carry the electronic module, contains the backplane bus

with power supply for the electronic, the DC 24V power section supply and the staircase-

shaped terminal for wiring. Additionally the terminal module has a locking system for

fixing at a mounting rail. By means of this locking system your SLIO system may be

assembled outside of your switchgear cabinet to be later mounted there as whole system.

The functionality of a SLIO periphery module is defined by the electronic module, which is

mounted to the terminal module by a sliding mechanism. With an error the defective

module may be exchanged for a functional module with standing installation. At the front

side there are LEDs for status indication. For simple wiring each module shows a corre-

sponding connection diagram at the front and at the side.

Line extension

Periphery modules

Terminal module

Electronic module

VIPA System SLIO

Basics and mounting

System conception > Components

HB300 | CPU | 013-CCF0R00 | en | 19-30 15

2.2.3 Accessories

The shield bus carrier (order no.: 000-0AB00) serves to carry the shield bus (10mm x

3mm) to connect cable shields. Shield bus carriers, shield bus and shield fixings are not

in the scope of delivery

. They are only available as accessories. The shield bus carrier is

mounted underneath the terminal of the terminal module. With a flat mounting rail for

adaptation to a flat mounting rail you may remove the spacer of the shield bus carrier.

With each head module, to protect the backplane bus connectors, there is a mounted bus

cover in the scope of delivery

. You have to remove the bus cover of the head module

before mounting a System SLIO module. For the protection of the backplane bus con-

nector you always have to mount the bus cover at the last module of your system again.

The bus cover has the order no. 000-0AA00.

There is the possibility to fix the assignment of electronic and terminal module. Here

coding pins (order number 000-0AC00) from VIPA can be used. The coding pin consists

of a coding jack and a coding plug. By combining electronic and terminal module with

coding pin, the coding jack remains in the electronic module and the coding plug in the

terminal module. This ensures that after replacing the electronics module just another

electronic module can be plugged with the same encoding.

Shield bus carrier

Bus cover

Coding pins

VIPA System SLIO

Basics and mounting

System conception > Accessories

HB300 | CPU | 013-CCF0R00 | en | 19-30 16

2.2.4 Hardware revision

n The hardware revision version is printed on every System SLIO module.

n Since a System SLIO module consists of a terminal and electronics module, you will

find a hardware revision on each of them.

n Authoritative for the hardware revision of a System SLIO module is the hardware revi-

sion of the electronic module. This is always located under the labeling strip of the

corresponding electronic module.

n On modules without labeling strip, such as CPUs, the hardware revision is printed on

the front.

The example here shows the hardware revision 1.

1 is marked with ‘X’ .

On the CPUs and some bus couplers, you can output the hardware revision ‘HW

Revision’ via the integrated web server.

2.3 Dimensions

Hardware revision on the

front

Hardware revision via web

server

Dimensions CPU 01xC

VIPA System SLIO

Basics and mounting

Dimensions

HB300 | CPU | 013-CCF0R00 | en | 19-30 17

Dimensions CPU 01x

Dimensions bus coupler

and line extension slave

Dimensions line extension

master

VIPA System SLIO

Basics and mounting

Dimensions

HB300 | CPU | 013-CCF0R00 | en | 19-30 18

Dimensions in mm

Dimension periphery

module

Dimensions electronic

module

VIPA System SLIO

Basics and mounting

Dimensions

HB300 | CPU | 013-CCF0R00 | en | 19-30 19

2.4 Mounting

Requirements for UL compliance use

– Use for power supply exclusively SEL

V/PELV power supplies.

– The System SLIO must be installed and operated in a housing

according to IEC 61010-1 9.3.2 c).

2.4.1 Mounting CPU 01xC

There are locking lever at the top side of the CPU. For mounting and demounting these

locking lever are to be turned upwards until these engage. Place the CPU at the

mounting rail. The CPU is fixed to the mounting rail by pushing downward the locking

levers. The CPU is directly mounted at a mounting rail. Up to 64 modules may be

mounted. The electronic and power section supply are connected via the backplane bus.

Please consider here that the sum current of the electronic power supply does not

exceed the maximum value of 1A. By means of the power module 007-1AB10 the current

of the electronic power supply may be expanded accordingly

.

1. Mount the mounting rail! Please consider that a clearance from the middle of the

mounting rail of at least 80mm above and 60mm below

, respectively 80mm by

deployment of shield bus carriers, exist.

Proceeding

VIPA System SLIO

Basics and mounting

Mounting > Mounting CPU 01xC

HB300 | CPU | 013-CCF0R00 | en | 19-30 20

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