VIPA CPU 019-CEFPM00 Manuale del proprietario

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Manuale del proprietario
CPU | 019-CEFPM00 | Manual
HB300 | CPU | 019-CEFPM00 | en | 23-12
System SLIO
SPEED7 CPU 019PN
019-CEFPM00_000_CPU 019PN,4,EN - © 2023
YASKAWA Europe GmbH
Philipp-Reis-Str. 6
65795 Hattersheim
Germany
Tel.: +49 6196 569-300
Fax: +49 6196 569-398
Internet: www.yaskawa.eu.com
Table of contents
1 General.................................................................................................................... 8
1.1 Copyright © YASKAWA Europe GmbH............................................................ 8
1.2 About this manual............................................................................................. 9
1.3 Safety information........................................................................................... 10
2 Basics and mounting........................................................................................... 11
2.1 Safety notes for the user................................................................................. 11
2.2 System conception......................................................................................... 12
2.2.1 Overview...................................................................................................... 12
2.2.2 Components................................................................................................ 13
2.2.3 Accessories................................................................................................. 16
2.2.4 Hardware revision........................................................................................ 18
2.3 Dimensions..................................................................................................... 18
2.4 Mounting......................................................................................................... 21
2.4.1 Mounting CPU 01x...................................................................................... 21
2.5 Wiring............................................................................................................. 23
2.5.1 Wiring CPU 01x........................................................................................... 23
2.5.2 Wiring 8x periphery modules....................................................................... 26
2.5.3 Wiring 16x periphery modules..................................................................... 28
2.5.4 Wiring power modules................................................................................. 28
2.6 Demounting.................................................................................................... 32
2.6.1 Demounting CPU 01x.................................................................................. 32
2.6.2 Demounting 8x periphery modules.............................................................. 34
2.6.3 Demounting 16x periphery modules............................................................ 37
2.6.4 Easy Maintenance....................................................................................... 40
2.7 Trouble shooting - LEDs................................................................................. 41
2.8 Industrial security and installation guidelines................................................. 42
2.8.1 Industrial security in information technology................................................ 42
2.8.2 Installation guidelines.................................................................................. 44
2.9 General data for the System SLIO................................................................. 46
2.9.1 Use in difficult operating conditions............................................................. 48
3 Hardware description........................................................................................... 49
3.1 Properties....................................................................................................... 49
3.2 Structure......................................................................................................... 50
3.2.1 Basic CPU................................................................................................... 50
3.2.2 Interfaces..................................................................................................... 51
3.2.3 Memory management.................................................................................. 53
3.2.4 Slot for storage media................................................................................. 53
3.2.5 Buffering mechanisms................................................................................. 54
3.2.6 Operating mode switch................................................................................ 54
3.2.7 LEDs............................................................................................................ 55
3.3 Technical data................................................................................................. 60
4 Deployment CPU 019-CEFPM00.......................................................................... 70
4.1 Please note!.................................................................................................... 70
4.2 Assembly........................................................................................................ 70
4.3 Start-up behavior............................................................................................ 70
4.4 Addressing...................................................................................................... 71
4.4.1 Overview...................................................................................................... 71
System SLIO Table of contents
HB300 | CPU | 019-CEFPM00 | en | 23-12 3
4.4.2 Addressing backplane bus periphery.......................................................... 71
4.5 Hardware configuration - CPU........................................................................ 72
4.6 Hardware configuration - I/O modules............................................................ 75
4.7 Hardware configuration - Ethernet PG/OP channel........................................ 76
4.7.1 Time-of-day synchronization....................................................................... 79
4.8 Setting standard CPU parameters.................................................................. 79
4.8.1 Parameterization via Siemens CPU............................................................ 79
4.8.2 Parameter CPU........................................................................................... 80
4.8.3 Parameter for MPI/DP................................................................................. 83
4.9 Setting product specific CPU parameters....................................................... 84
4.9.1 Free Module Mapping.................................................................................. 87
4.9.2 Access settings............................................................................................ 92
4.10 Project transfer............................................................................................. 93
4.10.1 Transfer via MPI/PROFIBUS..................................................................... 93
4.10.2 Transfer via Ethernet................................................................................. 95
4.10.3 Transfer via memory card.......................................................................... 96
4.11 Accessing the web server............................................................................. 97
4.11.1 Device web page CPU............................................................................... 97
4.11.2 Device web page Ethernet CP................................................................. 105
4.12 Operating modes........................................................................................ 111
4.12.1 Overview.................................................................................................. 111
4.12.2 Function security...................................................................................... 113
4.13 Overall reset............................................................................................... 114
4.14 Firmware update......................................................................................... 115
4.14.1 Firmware update online........................................................................... 116
4.14.2 Firmware update via memory card.......................................................... 117
4.15 Reset to factory settings............................................................................. 119
4.16 Deployment storage media - VSD, VSC..................................................... 120
4.17 Extended know-how protection.................................................................. 122
4.18 CMD - auto commands............................................................................... 123
4.19 Control and monitoring of variables with test functions.............................. 125
4.20 Diagnostic entries....................................................................................... 126
5 Deployment OPC UA.......................................................................................... 127
5.1 General......................................................................................................... 127
5.2 Basics OPC UA............................................................................................ 128
5.2.1 OPC UA..................................................................................................... 128
5.2.2 Information modeling................................................................................. 129
5.2.3 OPC UA data types and their conversion.................................................. 131
5.2.4 Integrated security concept....................................................................... 133
5.3 Activate OPC UA functionality...................................................................... 135
5.4 Usage in SPEED7 Studio............................................................................. 136
5.5 Usage in Siemens SIMATIC Manager.......................................................... 136
5.5.1 Precondition............................................................................................... 136
5.5.2 Installation OPC UA Configurator.............................................................. 137
5.5.3 Steps of the OPC UA configuration........................................................... 139
5.6 Usage in Siemens TIA Portal....................................................................... 139
5.6.1 Precondition............................................................................................... 139
5.6.2 Installation OPC UA Configurator.............................................................. 140
5.6.3 Steps of the OPC UA configuration........................................................... 142
System SLIO
Table of contents
HB300 | CPU | 019-CEFPM00 | en | 23-12 4
5.7 Usage OPC UA Configurator........................................................................ 143
5.7.1 OPC UA Configurator................................................................................ 143
5.7.2 Project tree ............................................................................................ 144
5.7.3 Device properties .................................................................................. 145
5.7.4 Server settings - Connection ................................................................. 147
5.7.5 Server settings - Certificate ................................................................... 149
5.7.6 Data access .......................................................................................... 150
5.7.7 User management ................................................................................ 151
5.7.8 Role management ................................................................................. 152
5.7.9 Output ................................................................................................... 152
6 Deployment WebVisu - Web visualization........................................................ 153
6.1 WebVisu editor............................................................................................. 153
6.1.1 Working environment................................................................................. 154
6.1.2 Creating a WebVisu project....................................................................... 154
6.2 Activate WebVisu functionality..................................................................... 156
6.3 Start-up of the WebVisu project.................................................................... 156
6.4 Access to the WebVisu................................................................................. 157
6.4.1 Status of the WebVisu............................................................................... 157
7 Deployment PtP communication...................................................................... 158
7.1 Fast introduction........................................................................................... 158
7.2 Principle of the data transfer......................................................................... 159
7.3 Deployment of RS485 interface for PtP........................................................ 160
7.4 Parametrization............................................................................................ 161
7.4.1 FC/SFC 216 - SER_CFG - Parametrization PtP....................................... 161
7.5 Communication............................................................................................. 161
7.5.1 FC/SFC 217 - SER_SND - Send to PtP.................................................... 161
7.5.2 FC/SFC 218 - SER_RCV - Receive from PtP........................................... 161
7.6 Protocols and procedures............................................................................. 161
7.7 Modbus - Function codes ............................................................................ 166
8 Deployment PROFIBUS communication.......................................................... 170
8.1 Overview....................................................................................................... 170
8.2 Fast introduction........................................................................................... 171
8.3 Hardware configuration - CPU...................................................................... 171
8.4 Deployment as PROFIBUS DP master........................................................ 173
8.5 Deployment as PROFIBUS DP slave........................................................... 174
8.5.1 Diagnostic functions.................................................................................. 176
8.6 PROFIBUS installation guidelines................................................................ 179
8.7 Commissioning and Start-up behavior......................................................... 181
9 Deployment Ethernet communication - productive........................................ 183
9.1 Basics - Industrial Ethernet in automation.................................................... 183
9.2 Basics - ISO/OSI reference model............................................................... 184
9.3 Basics - Terms.............................................................................................. 186
9.4 Basics - Protocols......................................................................................... 187
9.5 Basics - IP address and subnet.................................................................... 188
9.6 Fast introduction........................................................................................... 190
9.7 Hardware configuration................................................................................ 190
9.8 Configure Siemens S7 connections............................................................. 190
9.9 Configure Open Communication.................................................................. 196
9.10 NCM diagnostic - Help for error diagnostic................................................. 198
System SLIO Table of contents
HB300 | CPU | 019-CEFPM00 | en | 23-12 5
10 Deployment Ethernet communication - PROFINET........................................ 201
10.1 Basics PROFINET...................................................................................... 201
10.2 PROFINET installation guidelines.............................................................. 203
10.3 Deployment as PROFINET IO controller.................................................... 204
10.3.1 Steps of configuration.............................................................................. 204
10.3.2 Commissioning and initialization............................................................. 204
10.3.3 Configuration PROFINET IO controller................................................... 205
10.3.4 Configuration PROFINET IO device........................................................ 208
10.4 Deployment as PROFINET I-Device.......................................................... 209
10.4.1 Steps of configuration.............................................................................. 209
10.4.2 Installation of the GSDML files................................................................ 210
10.4.3 Configuration as I-Device........................................................................ 210
10.4.4 Configuration in the higher-level IO controller......................................... 212
10.4.5 Error behavior and interrupts................................................................... 213
10.5 Process data qualifiers in PROFINET frames............................................ 215
10.6 MRP............................................................................................................ 217
10.7 Topology..................................................................................................... 218
10.8 Device replacement without exchangeable medium/PG............................ 219
10.9 Commissioning and start-up behavior........................................................ 220
10.10 PROFINET diagnostics............................................................................ 221
10.10.1 Overview................................................................................................ 221
10.10.2 Diagnostics with the configuration and engineering tool....................... 221
10.10.3 Diagnostics during runtime in the user program.................................... 222
10.10.4 Diagnostics via OB start information..................................................... 223
10.10.5 Diagnostics via status LEDs.................................................................. 224
10.11 PROFINET system limits.......................................................................... 226
11 Configuration with SPEED7 Studio.................................................................. 227
11.1 SPEED7 Studio - Overview........................................................................ 227
11.2 SPEED7 Studio - Work environment.......................................................... 228
11.2.1 Project tree ............................................................................................. 230
11.2.2 Catalog ................................................................................................... 231
11.3 SPEED7 Studio - Hardware configuration - CPU....................................... 233
11.4 SPEED7 Studio - Hardware configuration - Ethernet PG/OP channel....... 233
11.5 SPEED7 Studio - Hardware configuration - I/O modules........................... 236
11.6 Deployment OPC UA.................................................................................. 237
11.7 Deployment WebVisu - Web visualization.................................................. 237
11.8 SPEED7 Studio - Project transfer............................................................... 237
11.8.1 Transfer via MPI....................................................................................... 238
11.8.2 Transfer via Ethernet............................................................................... 239
11.8.3 Transfer via memory card........................................................................ 240
12 Configuration with TIA Portal............................................................................ 242
12.1 TIA Portal - Work environment .................................................................. 242
12.1.1 General.................................................................................................... 242
12.1.2 Work environment of the TIA Portal........................................................ 243
12.2 TIA Portal - Functional limitations............................................................... 244
12.3 TIA Portal - Hardware configuration - CPU................................................ 245
12.4 TIA Portal - Hardware configuration - Ethernet PG/OP channel................ 248
12.4.1 Time-of-day synchronization................................................................... 250
12.5 TIA Portal - Hardware configuration - I/O modules..................................... 252
System SLIO
Table of contents
HB300 | CPU | 019-CEFPM00 | en | 23-12 6
12.6 TIA Portal - Deployment PROFINET.......................................................... 253
12.6.1 TIA Portal - Configuration PROFINET IO controller................................ 253
12.6.2 TIA Portal - Configuration PROFINET I-Device....................................... 257
12.7 TIA Portal - Deployment PROFIBUS communication................................. 264
12.7.1 Fast introduction...................................................................................... 264
12.7.2 Hardware configuration - CPU................................................................. 264
12.7.3 Deployment as PROFIBUS DP master................................................... 264
12.7.4 Deployment as PROFIBUS DP slave...................................................... 266
12.8 Deployment OPC UA.................................................................................. 267
12.9 TIA Portal - Include Controls Library.......................................................... 268
12.10 TIA Portal - Project transfer...................................................................... 268
12.10.1 Transfer via MPI.................................................................................... 269
12.10.2 Transfer via Ethernet............................................................................. 269
12.10.3 Transfer via memory card...................................................................... 270
Appendix............................................................................................................. 271
A System specific event IDs............................................................................... 273
B Integrated blocks............................................................................................. 325
C SSL partial list................................................................................................. 329
System SLIO Table of contents
HB300 | CPU | 019-CEFPM00 | en | 23-12 7
1 General
1.1 Copyright © YASKAWA Europe GmbH
This document contains proprietary information of Yaskawa and is not to be disclosed or
used except in accordance with applicable agreements.
This material is protected by copyright laws. It may not be reproduced, distributed, or
altered in any fashion by any entity (either internal or external to Yaskawa) except in
accordance with applicable agreements, contracts or licensing, without the express
written consent of Yaskawa and the business management owner of the material.
For permission to reproduce or distribute, please contact: YASKAWA Europe GmbH,
European Headquarters, Philipp-Reis-Str. 6, 65795 Hattersheim, Germany
Tel.: +49 6196 569 300
Fax.: +49 6196 569 398
Internet: www.yaskawa.eu.com
Hereby, YASKAWA Europe GmbH declares that the products and systems are in compli-
ance with the essential requirements and other relevant provisions. Conformity is indi-
cated by the CE marking affixed to the product.
For more information regarding CE marking and Declaration of Conformity (DoC), please
contact your local representative of YASKAWA Europe GmbH.
SLIO and SPEED7 are registered trademarks of YASKAWA Europe GmbH.
SIMATIC, STEP, SINEC, TIA Portal, S7-300 and S7-400 are registered trademarks of
Siemens AG.
PROFINET and PROFIBUS are registered trademarks of PROFIBUS and PROFINET
International (PI).
EtherCAT is a registered trademark of Beckhoff Automation GmbH.
All Microsoft Windows, Office and Server products mentioned are registered trademarks
of Microsoft Inc., USA.
All other trademarks, logos and service or product marks specified herein are owned by
their respective companies.
Every effort has been made to ensure that the information contained in this document
was complete and accurate at the time of publishing. We cannot guarantee that the infor-
mation is free of errors, and we reserve the right to change the information at any time.
There is no obligation to inform the customer about any changes. The customer is
requested to actively keep his documents up to date. The customer is always responsible
for the deployment of the products with the associated documentation, taking into
account the applicable directives and standards.
This documentation describes all hardware and software units and functions known
today. It is possible that units are described that do not exist at the customer. The exact
scope of delivery is described in the respective purchase contract.
Contact your local representative of YASKAWA Europe GmbH if you have errors or ques-
tions regarding the content of this document. You can reach YASKAWA Europe GmbH via
the following contact:
All Rights Reserved
EC conformity declaration
Conformity Information
Trademarks
General terms of use
Document support
System SLIO
General
Copyright © YASKAWA Europe GmbH
HB300 | CPU | 019-CEFPM00 | en | 23-12
8
Contact your local representative of YASKAWA Europe GmbH if you encounter problems
or have questions regarding the product. If such a location is not available, you can reach
the Yaskawa customer service via the following contact:
YASKAWA Europe GmbH,
European Headquarters, Philipp-Reis-Str. 6, 65795 Hattersheim, Germany
Tel.: +49 6196 569 500 (hotline)
1.2 About this manual
This manual describes the CPU 019-CEFPM00 of the System SLIO.
nIt describes the structure, configuration and application.
nThe manual is written for users with basic knowledge of automation technology.
nThe manual consists of chapters. Each chapter describes a completed topic.
nThe following guides are available in the manual:
An overall table of contents at the beginning of the manual.
References with pages numbers.
Validity of the documentation
Product Order number as of version:
CPU 019PN 019-CEFPM00 CPU-HW: 01 CPU-FW: V3.0.16 CP-FW: V2.6.3
Important passages in the text are highlighted by following icons and headings:
DANGER!
Immediate or likely danger. Personal injury is possible.
CAUTION!
Damages to property is likely if these warnings are not heeded.
Supplementary information and useful tips.
Technical support
Objective and contents
Icons Headings
System SLIO General
About this manual
HB300 | CPU | 019-CEFPM00 | en | 23-12 9
1.3 Safety information
The system is constructed and produced for:
ncommunication and process control
ngeneral control and automation tasks
nindustrial applications
noperation within the environmental conditions specified in the technical data
ninstallation into a cubicle
DANGER!
This device is not certified for applications in
in explosive environments (EX-zone)
The manual must be available to all personnel in the
nproject design department
ninstallation department
ncommissioning
noperation
CAUTION!
The following conditions must be met before using or commis-
sioning the components described in this manual:
Hardware modifications to the process control system should only be
carried out when the system has been disconnected from power!
Installation and hardware modifications only by properly trained per-
sonnel.
The national rules and regulations of the respective country must be
satisfied (installation, safety, EMC ...)
National rules and regulations apply to the disposal of the unit!
Applications conforming
with specifications
Documentation
Disposal
System SLIO
General
Safety information
HB300 | CPU | 019-CEFPM00 | en | 23-12 10
2 Basics and mounting
2.1 Safety notes for the user
DANGER!
Protection against dangerous voltages
When using System SLIO modules, the user must be protected from
touching hazardous voltage.
You must therefore create an insulation concept for your system that
includes safe separation of the potential areas of ELV and hazardous
voltage.
Here, observe the insulation voltages between the potential areas
specified for the System SLIO modules and take suitable measures,
such as using PELV/SELV power supplies for System SLIO modules.
The modules are equipped with highly integrated components in MOS technology. These
components are highly sensitive to over-voltages that occur, e.g. with electrostatic dis-
charge. The following symbol is used to identify these hazardous modules:
The symbol is located on modules, module racks or on packaging and thus indicates
electrostatic sensitive modules. Electrostatic sensitive modules can be destroyed by
energies and voltages that are far below the limits of human perception. If a person who
is not electrically discharged handles electrostatic sensitive modules, voltages can occur
and damage components and thus impair the functionality of the modules or render the
modules unusable. Modules damaged in this way are in most cases not immediately rec-
ognized as faulty. The error can only appear after a long period of operation. Components
damaged by static discharge can show temporary faults when exposed to temperature
changes, vibrations or load changes. Only the consistent use of protective devices and
responsible observance of the handling rules can effectively prevent malfunctions and
failures on electrostatic sensitive modules.
Please always use the original packaging for shipping.
For measurements on electrostatic sensitive modules the following must be observed:
nFloating measuring instruments must be discharged before use.
nMeasuring instruments used must be grounded.
When modifying electrostatic sensitive modules, ensure that a grounded soldering iron is
used.
CAUTION!
When working with and on electrostatic sensitive modules, make sure
that personnel and equipment are adequately grounded.
Handling of electrostatic
sensitive modules
Shipping of modules
Measurement and modifi-
cation of electrostatic sen-
sitive modules
System SLIO Basics and mounting
Safety notes for the user
HB300 | CPU | 019-CEFPM00 | en | 23-12 11
2.2 System conception
2.2.1 Overview
The System SLIO is a modular automation system for assembly on a 35mm mounting
rail. By means of the periphery modules with 2, 4, 8 and 16 channels this system may
properly be adapted matching to your automation tasks. The wiring complexity is low,
because the supply of the DC 24V power section supply is integrated to the backplane
bus and defective modules may be replaced with standing wiring. By deployment of the
power modules in contrasting colors within the system, further isolated areas may be
defined for the DC 24V power section supply, respectively the electronic power supply
may be extended with 2A.
System SLIO
Basics and mounting
System conception > Overview
HB300 | CPU | 019-CEFPM00 | en | 23-12 12
2.2.2 Components
nCPU (head module)
nBus coupler (head module)
nLine extension
n8x periphery modules
n16x periphery modules
nPower modules
nAccessories
CAUTION!
Only Yaskawa modules may be combined. A mixed operation with third-
party modules is not allowed!
With the CPU 01xC electronic, input/output components and power supply are integrated
to one casing. In addition, up to 64 periphery modules of the System SLIO can be con-
nected to the backplane bus. As head module via the integrated power module for power
supply CPU electronic and the I/O components are supplied as well as the electronic of
the periphery modules, which are connected via backplane bus. To connect the power
supply of the I/O components and for DC 24V power section supply of via backplane bus
connected periphery modules, the CPU has removable connectors. By installing of up to
64 periphery modules at the backplane bus, these are electrically connected, this means
these are assigned to the backplane bus, the electronic modules are power supplied and
each periphery module is connected to the DC 24V power section supply.
With this CPU 01x, CPU electronic and power supply are integrated to one casing. As
head module, via the integrated power module for power supply, CPU electronic and the
electronic of the connected periphery modules are supplied. The DC 24V power section
supply for the linked periphery modules is established via a further connection of the
power module. By installing of up to 64 periphery modules at the backplane bus, these
are electrically connected, this means these are assigned to the backplane bus, the elec-
tronic modules are power supplied and each periphery module is connected to the DC
24V power section supply.
CAUTION!
CPU part and power module may not be separated!
Here you may only exchange the electronic module!
CPU 01xC
CPU 01x
System SLIO Basics and mounting
System conception > Components
HB300 | CPU | 019-CEFPM00 | en | 23-12 13
With a bus coupler bus interface and power module is integrated to one casing. With the
bus interface you get access to a subordinated bus system. As head module, via the inte-
grated power module for power supply, bus interface and the electronic of the connected
periphery modules are supplied. The DC 24V power section supply for the linked
periphery modules is established via a further connection of the power module. By instal-
ling of up to 64 periphery modules at the bus coupler, these are electrically connected,
this means these are assigned to the backplane bus, the electronic modules are power
supplied and each periphery module is connected to the DC 24V power section supply.
CAUTION!
Bus interface and power module may not be separated!
Here you may only exchange the electronic module!
In the System SLIO there is the possibility to place up to 64 modules in on line. By means
of the line extension you can divide this line into several lines. Here you have to place a
line extension master at each end of a line and the subsequent line has to start with a line
extension slave. Master and slave are to be connected via a special connecting cable. In
this way, you can divide a line on up to 5 lines. Depending on the line extension, the max.
number of pluggable modules at the System SLIO bus is decreased accordingly. To use
the line extension no special configuration is required.
Please note that some modules do not support line extensions due to the
system. For more information, please refer to the compatibility list. This
can be found in the ‘Download Center’ of www.yaskawa.eu.com under
‘System SLIO Compatibility list’ .
The periphery modules are available in the following 2 versions, whereby of each the
electronic part can be replaced with standing wiring:
n8x periphery module for a maximum of 8 channels.
n16x periphery module for a maximum of 16 channels.
Bus coupler
Line extension
Periphery modules
System SLIO
Basics and mounting
System conception > Components
HB300 | CPU | 019-CEFPM00 | en | 23-12 14
Each 8x periphery module consists of a terminal and an electronic module.
1 Terminal module
2 Electronic module
The terminal module serves to carry the electronic module, contains the backplane bus
with power supply for the electronic, the DC 24V power section supply and the staircase-
shaped terminal for wiring. Additionally the terminal module has a locking system for
fixing at a mounting rail. By means of this locking system your system may be assembled
outside of your switchgear cabinet to be later mounted there as whole system.
The functionality of a periphery module is defined by the electronic module, which is
mounted to the terminal module by a sliding mechanism. With an error the defective elec-
tronic module may be exchanged for a functional module with standing installation. At the
front side there are LEDs for status indication. For simple wiring each module shows cor-
responding connection information at the front and at the side.
Each 16x periphery module consists of an electronic unit and a terminal block.
1
2
1 Electronic unit
2 Terminal block
8x periphery modules
Terminal module
Electronic module
16x periphery modules
System SLIO Basics and mounting
System conception > Components
HB300 | CPU | 019-CEFPM00 | en | 23-12 15
The functionality of a 16x periphery module is defined via the terminal block, which is
connected to the electronic unit via a secure flap mechanism. In the case of an error you
can exchange the defective electronic unit for a functional unit with standing wiring. At the
front side there are LEDs for status indication. For easy wiring each electronic unit shows
corresponding connection information at the side. The electronic unit provides the slot for
the terminal block for the wiring and contains the backplane bus with power supply for the
electronic and the connection to the DC 24V power section supply. Additionally the elec-
tronic unit has a locking system for fixing it at a mounting rail. By means of this locking
system your system may be assembled outside of your switchgear cabinet to be later
mounted there as whole system.
The terminal block provides the electrical interface for the signalling and supplies lines of
the module. When mounting the terminal block, it is attached to the bottom of the elec-
tronic unit and turned towards the electronic unit until it clicks into place. With the wiring a
"push-in" spring-clip technique is used. This allows a quick and easy connection of your
signal and supply lines. The clamping off takes place by means of a screwdriver.
In the System SLIO the power supply is established by power modules. These are either
integrated to the head module or may be installed between the periphery modules.
Depending on the power module isolated areas of the DC 24V power section supply may
be defined respectively the electronic power supply may be extended with 2A. For better
recognition the colour of the power modules are contrasting to the periphery modules.
2.2.3 Accessories
Please note that a shield bus carrier cannot be mounted on a 16x
periphery module!
The shield bus carrier (order no.: 000-0AB00) serves to carry the shield bus (10mm x
3mm) to connect cable shields. Shield bus carriers, shield bus and shield fixings are not
in the scope of delivery. They are only available as accessories. The shield bus carrier is
mounted underneath the terminal of the terminal module. With a flat mounting rail for
adaptation to a flat mounting rail you may remove the spacer of the shield bus carrier.
Electronic unit
Terminal block
Power module
Shield bus carrier
System SLIO
Basics and mounting
System conception > Accessories
HB300 | CPU | 019-CEFPM00 | en | 23-12 16
With each head module, to protect the backplane bus connectors, there is a mounted bus
cover in the scope of delivery. You have to remove the bus cover of the head module
before mounting a System SLIO module. For the protection of the backplane bus con-
nector you always have to mount the bus cover at the last module of your system again.
The bus cover has the order no. 000-0AA00.
Please note that a coding pin cannot be installed on a 16x periphery
module! Here you have to make sure that the associated terminal block is
plugged again when the electronics unit is replaced.
There is the possibility to fix the assignment of electronic and terminal module. Here
coding pins (order number 000-0AC00) can be used. The coding pin consists of a coding
jack and a coding plug. By combining electronic and terminal module with coding pin, the
coding jack remains in the electronic module and the coding plug in the terminal module.
This ensures that after replacing the electronic module just another electronic module can
be plugged with the same encoding.
Bus cover
Coding pins
System SLIO Basics and mounting
System conception > Accessories
HB300 | CPU | 019-CEFPM00 | en | 23-12 17
2.2.4 Hardware revision
nThe hardware revision is printed on every System SLIO module.
nSince a System SLIO 8x periphery module consists of a terminal and electronic
module, you will find a hardware revision printed on each of them.
nAuthoritative for the hardware revision of a System SLIO module is the hardware revi-
sion of the electronic module. This is located under the labeling strip of the corre-
sponding electronic module.
nDepending on the module type, there are the following 2 variants e.g. to indicate
hardware revision 1:
With current labelling there is a
1
on the front.
With earlier labelling, the 1 is marked with ‘X’ on a number grid.
X 2
43 X 2
43
X 2
43
X 2
43
X2
43
11
1
1
On the CPUs and some bus couplers, you can check the hardware revision HW
Revision’ via the integrated web server.
2.3 Dimensions
All dimensions are in mm.
Hardware revision on the
front
Hardware revision via web
server
CPU 01xC
System SLIO
Basics and mounting
Dimensions
HB300 | CPU | 019-CEFPM00 | en | 23-12 18
CPU 01x
Bus coupler and line
extension slave
Line extension master
System SLIO Basics and mounting
Dimensions
HB300 | CPU | 019-CEFPM00 | en | 23-12 19
104
109
76.5 15
12.9
8x periphery module
Electronic module
16x periphery module
System SLIO
Basics and mounting
Dimensions
HB300 | CPU | 019-CEFPM00 | en | 23-12 20
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VIPA CPU 019-CEFPM00 Manuale del proprietario

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Software
Tipo
Manuale del proprietario

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