Tyan YR188-B537M Manuale utente

Categoria
Server barebone
Tipo
Manuale utente
http://www.tyan.com
1
YR188-B537M
Service Engineer’s Manual
http://www.tyan.com
2
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3
PREFACE
Copyright
This publication, including all photographs, illustrations, and software, is
protected under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced
without written consent of manufacturer.
Copyright 2009 MiTAC International Corporation. All rights reserved.
TYAN
®
is a registered trademark of MiTAC International Corporation.
Version 1.00
Disclaimer
Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliability prior to
printing. MiTAC assumes no liability whatsoever, and disclaims any
express or implied warranty, relating to sale and/or use of TYAN
®
products
including liability or warranties relating to fitness for a particular purpose or
merchantability. MiTAC retains the right to make changes to produce
descriptions and/or specifications at any time, without notice. In no event
will MiTAC be held liable for any direct or indirect, incidental or
consequential damage, loss of use, loss of data or other malady resulting
from errors or inaccuracies of information contained in this document.
Trademark Recognition
All registered and unregistered trademarks and company names
contained in this manual are property of their respective owners including,
but not limited to the following.
TYAN
®
is a trademark of MiTAC International Corporation.
Intel
®
is a trademark of Intel
®
Corporation.
AMI
®
, AMIBIOS
®
and combinations thereof are trademarks of AMI
Technologies.
Microsoft
®
, Windows
®
are trademarks of Microsoft Corporation.
IBM
®
, PC
®
, AT
®
and PS/2
®
are trademarks of IBM Corporation.
Winbond
®
is a trademark of Winbond Electronics Corporation.
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Federal Communication Commission (FCC)
Notice for the USA
Compliance Information Statement (Declaration of
Conformity Procedure) DoC FCC Part 15: This
device complies with part 15 of the FCC Rules
Operation is subject to the following conditions:
1) This device may not cause harmful interference;
2) This device must accept any interference received including
interference that may cause undesired operation. If this equipment
does cause harmful interference to radio or television reception,
which can be determined by turning the equipment off and on, the
user is encouraged to try one or more of the following measures:
– Reorient or relocate the receiving antenna.
– Increase the separation between the equipment and the receiver.
– Plug the equipment into an outlet on a circuit different from that of
the receiver.
Consult the dealer on an experienced radio/television technician for
help.
Notice for Canada
This apparatus complies with the Class A limits for radio interference as
specified in the Canadian Department of Communications Radio
Interference Regulations. (Cet appareil est conforme aux norms de
Classe A d’interference radio tel que specifie par le Ministere Canadien
des Communications dans les reglements d’ineteference radio.)
Notice for Europe (CE Mark)
This product is in conformity with the Council
Directive 89/336/EEC, 92/31/EEC (EMC).
CAUTION: Lithium battery included with this board. Do not puncture,
mutilate, or dispose of battery in fire. There will be danger of explosion if
battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by manufacturer. Dispose of used battery according
to manufacturer instructions and in accordance with your local
regulations.
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About this Manual
This manual provides you with instructions on installing your TYAN
YR188-B537M. This Manual is intended for experienced users and
integrators with hardware knowledge of personal computers.
This manual consists of the following parts:
Chapter1:
Provides an introduction to the TYAN YR188-B537M
barebones, standard parts list, describes the external
components, gives a table of key components, and
provides block diagram of the system.
Chapter2:
Covers procedures on installing the CPU, memory
modules and hard drives.
Chapter3:
Covers removal and replacement procedures for
pre-installed components.
Chapter4:
Covers the block diagram, MB layout and pin
definitions for headers and jumpers.
Chapter5:
Covers various BIOS settings that can be used to
configure your system.
Appendix:
List the cable connection and FRU part tables for
reference of system setup, and technical support
in
case a problem arises with your system.
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SAFETY INFORMATION
Before installing and using TYAN YR188-B537M, take note of the
following precautions:
·Read all instructions carefully.
·Do not place the unit on an unstable surface, cart, or stand.
·Do not block the slots and opening on the unit, which are provided for
ventilation.
·Only use the power source indicated on the marking label. If you are not
sure, contact the power company.
·The unit uses a three-wire ground cable, which is equipped with a third
pin to ground the unit and prevent electric shock. Do not defeat the
purpose of this pin. If you outlet does not support this kind of plug,
contact your electrician to replace your obsolete outlet.
·Do not place anything on the power cord. Place the power cord where it
will not be in the way of foot traffic.
·Follow all warnings and cautions in this manual and on the unit case.
·Do not push objects in the ventilation slots as they may touch high
voltage components and result in shock and damage to the
components.
·When replacing parts, ensure that you use parts specified by the
manufacturer.
·When service or repairs have been done, perform routine safety checks
to verify that the system is operating correctly.
·Avoid using the system near water, in direct sunlight, or near a heating
device.
·Cover the unit when not in use.
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Table of Contents
Chapter 1: Overview.........................................................................9
1.1 About the TYAN YR188-B537M ............................................... 9
1.2 Product Models....................................................................... 10
1.3 Features.................................................................................. 11
1.4 Standard Parts List ................................................................. 15
1.4.1 Box Contents Per Node................................................... 15
1.4.2 Accessories ..................................................................... 16
1.5 About the Product................................................................... 18
1.5.1 System Front View (Per Node)........................................ 18
1.5.2 System Rear View (Per Node) ........................................ 20
1.5.3 Internal View (Per Node) ................................................. 21
Chapter 2: Setting Up.....................................................................23
2.0.1 Before you Begin ............................................................. 23
2.0.2 Work Area........................................................................ 23
2.0.3 Tools ................................................................................ 23
2.0.4 Precautions...................................................................... 24
2.1 Installing Motherboard Components....................................... 25
2.1.1 Installing Hard Drives....................................................... 25
2.1.2 Installing the CPU and Heatsink...................................... 28
2.1.3 Installing the Memory....................................................... 31
2.2 Rack Mounting........................................................................ 33
2.2.1 Installing the Server in a Rack......................................... 33
2.2.2 Installing the inner Rails to the Chassis........................... 34
2.2.3 Installing the Outer Rails to the Rack .............................. 35
2.2.4 Rack mounting the Server ............................................... 36
Chapter 3: Replacing Pre-Installed Components ........................ 37
3.1 Introduction ............................................................................. 37
3.2 Disassembly Flowchart........................................................... 37
3.3 Removing the Cover............................................................... 39
3.4 Replacing Motherboard Components..................................... 39
3.4.1 Replacing Expansion Card .............................................. 39
3.4.2 Disconnecting All Motherboard Cables ........................... 41
3.4.3 Removing the Motherboard ............................................. 42
3.5 Replacing the Power Distribution Board ............................... 43
3.6 Replacing the Front Panel Board.......................................... 44
3.6.1 Front Panel Board Features ............................................ 46
3.6.2 Front Panel Board Connector Pin Definition ................... 46
3.7 Replacing the System Fan.................................................... 47
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3.8 Replacing the SATA Backplane Board................................. 49
3.8.1 SATA Backplane Board Features.................................... 50
3.8.2 SATA Backplane Board Connector Pin Definitions ......... 51
Chapter 4: Hardware Setup............................................................55
4.1 Motherboard (S537M) Image ................................................. 55
4.2 System Block Diagram ........................................................... 56
4.3 Board Parts, Jumpers and Connectors .................................. 57
4.4 Installing Optional SO-DIMM modules ................................... 63
Chapter 5: BIOS Setup ................................................................... 65
5.1 About the BIOS....................................................................... 65
5.2 BIOS Menu Bar....................................................................... 65
5.3 Setup Basics........................................................................... 66
5.4 Getting Help............................................................................ 66
5.5 In Case of Problems ............................................................... 66
5.6 BIOS Main Menu .................................................................... 67
5.7 Advanced Menu...................................................................... 68
5.7.1 CPU Configuration........................................................... 70
5.7.2 IDE Configuration Sub-Menu........................................... 72
5.7.3 Super IO Configuration Sub-Menu .................................. 76
5.7.4 USB Configuration Sub-Menu ......................................... 77
5.7.5 ACPI Configuration Sub-Menu ........................................ 80
5.7.6 AHCI Configuration Sub-Menu ........................................ 83
5.7.7 APM Configuration........................................................... 85
5.7.8 Event Log Configuration Sub-Menu ................................ 87
5.7.9 Hardware Health Configuration Sub-Menu ..................... 88
5.7.10 PCI Express Configuration Sub-Menu........................... 92
5.7.11 Remote Access Configuration Sub-Menu ..................... 93
5.8 PCI PnP Menu ........................................................................ 95
5.9 Boot Menu .............................................................................. 97
5.9.1 Boot Settings Configuration Sub-Menu ........................... 98
5.9.2 Boot Device Priority Sub-menu ..................................... 100
5.9.3 Hard Disk Drives Sub-menu .......................................... 101
5.9.4 CD/DVD Drives Sub-menu ............................................ 102
5.10 Security Menu..................................................................... 103
5.11 Chipset Menu...................................................................... 105
5.11.1 North Bridge Configuration Sub-Menu ........................ 106
5.11.2 South Bridge Configuration Sub-Menu........................ 108
5.12 Exit Menu............................................................................ 110
Appendix I: Cable Connection Tables ........................................ 113
Appendix II: FRU Parts Table ...................................................... 115
Appendix III: Technical Support.................................................. 117
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Chapter 1: Overview
1.1 About the TYAN YR188-B537M
Congratulations on your purchase of the TYAN
®
YR188-B537M, a highly
optimized rack-mountable barebone system. The YR188-B537M is
designed to support one Intel
®
5200/5400 processor and up to 32GB
DDR2-667/533 memory per node, providing a rich feature set and
incredible performance. Leveraging advanced technology from Intel
®
,
YR188-B537M server system is capable of offering scalable 32 and 64-bit
computing, high bandwidth memory design, and lightning-fast PCI-E bus
implementation. The YR188-B537M not only empowers your company in
nowadays IT demand but also offers a smooth path for future application
usage.
TYAN
®
is also proud to deliver the YR188-B537M in flavor while
supporting up to eight hot-swap hard drives (four per node). The
YR188-B537M uses TYAN
®
’s latest chassis featuring a robust structure
and a solid mechanical enclosure. All of this provides YR188-B537M the
power and flexibility to meet the needs of nowadays server application.
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1.2 Product Models
Model HDD Bays Power supply
B537MY188S1
(one node)
Hot-swap, 4 HDDs (1) 450W
B537MY188S2
(two nodes)
Hot-swap, 8 HDDs (2) 450W
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1.3 Features
TYAN YR188-B537M (B537MY188S2)
Form Factor
1U Rackmount
Chassis Name
YR188
Dimension (H x W x D)
1.71" x 17.26" x 28.74" (43.5 x 438.5 x 730mm)
Node Carrier Dimension
1.61" x 8.35" x 28.74" (40.8 x 212 x 730mm)
System
Feature
Two nodes in one chassis
Buttons
(1) RST / (1) ID / (1) PWR
LEDs
(1) Power / (1) BMC / (2) LAN / (1) HDD
Front Panel
I/O Ports
(2) USB ports
Type / Q'ty
2.5" Hot-Swap / (4) per node, total (8)
External Drive
Bay
Supported HDD
Interface
SATA-II 3.0Gb/s
System Cooling
Configuration
FAN (3) 4cm fans per node, total (6)
Output Watts
(1) 450 Watts per node, total (2)
Power Supply
Efficiency
PFC
Supported CPU Series
Intel® Xeon® processor 5400/5200 series
Socket Type / Q'ty
LGA771
Thermal Design Power
(TDP) wattage
80W
Processor
System Bus
FSB 1333/1066MHz
MCH / ICH
Intel 5100 / ICH9R
Chipset
Super I/O
Winbond W83627DHG
Supported DIMM Qty
(8) DIMM sockets per node, total (16)
DIMM Type / Speed
DDR2 667/533 RDIMM
Capacity
Up to 32GB RDIMM per node, total 64GB
Memory
Memory channel
2 Channels
PCI-E
(1) PCI-E Low-Profile x16 slot per node, total (2)
Expansion Slots
Pre-installed TYAN Riser
Card
M2087-R, PCI-E x16 1U riser card (right)
Port Q'ty
(2) per node, total (4)
LAN
Controller
Intel 82571EB
Controller
ICH9R
Speed
3.0 Gb/s
Storage SATA
RAID
RAID 0/1/10/5 (Intel
®
Matrix RAID)
Graphic Chipset
XGI Volari™ Z9s
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USB
(4) ports (2 at front, 2 at rear) per node, total (8)
COM
(1) DB-9 port per node, total (2)
VGA
(1) D-sub port per node, total (2)
I/O Ports
RJ-45
(3) ports per node, total (6)
Chipset Winbond W83793G
Voltage
Monitors voltage for CPU, memory, chipset & power
supply
Temperature Monitors temperature for CPU & system environment
LED
Fan fail LED indicator / Over temperature warning
indicator
System Monitoring
Others Watchdog timer support
Optional SMDC M3296 IPMI 2.0 remote system management card
Server
Management
M3296 Feature
KIRA 100 (Single Chip KVM/IP+IPMI processor) / KVM
over IP / Video output over LAN (1280x1024) / Card
interface: DDR2 SO-DIMM socket / USB2 high speed
interface / Remote CD-ROM (media) redirect / Remote
power on/off, reset and soft off
Brand / ROM size AMI / 1MB
BIOS
Feature
Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3 /PXE
boot / ACPI 2.0 power management /Power on mode
after power recovery / User-configurable H/W monitoring
/ Auto-configurable of hard disk types / Multiple boot
options
Operating System OS supported list
Please refer to our OS supported list.
FCC (DoC) Class A
Regulation
CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)
Operating
Environment
In/Non-operating Humidity 90%, non-condensing at 35° C
RoHS RoHS 6/6 Complaint Yes
Barebone (1) B537MY188S2 Barebone
Manual (1) MB Quick Reference + (1) BB User's manual
Installation CD (1) TYAN installation CD
Heatsink / Cooler (2) LGA771 CPU heatsinks
Rail kit (1) sliding rail kit
Contains
Cable Power Cord
(2) CCBL-0310, US type power cord / (2) CCBL-0300, EU
type power cord
Optional
accessories for
future upgrade
SMDC IPMI Card M3296
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TYAN YR188-B537M (B537MY188S1)
Form Factor
1U Rackmount
Chassis Name
YR188
Dimension (H x W x D)
1.71" x 17.26" x 28.74" (43.5 x 438.5 x 730mm)
Node Carrier Dimension
1.61" x 8.35" x 28.74" (40.8 x 212 x 730mm)
System
Feature
One nodes in one chassis
Buttons
(1) RST / (1) ID / (1) PWR
LEDs
(1) Power / (1) BMC / (2) LAN / (1) HDD
Front Panel
I/O Ports
(2) USB ports
Type / Q'ty
2.5" Hot-Swap / (4) per node
External Drive
Bay
Supported HDD
Interface
SATA-II 3.0Gb/s
System Cooling
Configuration
FAN (3) 4cm fans per node
Output Watts
(1) 450 Watts per node
Power Supply
Efficiency
PFC
Supported CPU Series
Intel® Xeon® processor 5400/5200 series
Socket Type / Q'ty
LGA771
Thermal Design Power
(TDP) wattage
80W
Processor
System Bus
FSB 1333/1066MHz
MCH / ICH
Intel 5100 / ICH9R
Chipset
Super I/O
Winbond W83627DHG
Supported DIMM Qty
(8) DIMM sockets per node
DIMM Type / Speed
DDR2 667/533 RDIMM
Capacity
Up to 32GB RDIMM per node
Memory
Memory channel
2 Channels
PCI-E
(1) PCI-E Low-Profile x16 slot per node
Expansion Slots
Pre-installed TYAN Riser
Card
M2087-R, PCI-E x16 1U riser card (right)
Port Q'ty
(2) per node
LAN
Controller
Intel 82571EB
Controller
ICH9R
Speed
3.0 Gb/s
Storage SATA
RAID
RAID 0/1/10/5 (Intel
®
Matrix RAID)
Graphic Chipset
XGI Volari™ Z9s
USB
(4) ports (2 at front, 2 at rear) per node
I/O Ports
COM
(1) DB-9 port per node
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VGA
(1) D-sub port per node
RJ-45
(3) ports per node
Chipset Winbond W83793G
Voltage
Monitors voltage for CPU, memory, chipset & power
supply
Temperature Monitors temperature for CPU & system environment
LED
Fan fail LED indicator / Over temperature warning
indicator
System Monitoring
Others Watchdog timer support
Optional SMDC M3296 IPMI 2.0 remote system management card
Server
Management
M3296 Feature
KIRA 100 (Single Chip KVM/IP+IPMI processor) / KVM
over IP / Video output over LAN (1280x1024) / Card
interface: DDR2 SO-DIMM socket / USB2 high speed
interface / Remote CD-ROM (media) redirect / Remote
power on/off, reset and soft off
Brand / ROM size AMI / 1MB
BIOS
Feature
Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3 /PXE
boot / ACPI 2.0 power management /Power on mode
after power recovery / User-configurable H/W monitoring
/ Auto-configurable of hard disk types / Multiple boot
options
Operating System OS supported list Please refer to our OS supported list.
FCC (DoC) Class A
Regulation
CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)
Operating
Environment
In/Non-operating Humidity 90%, non-condensing at 35° C
RoHS RoHS 6/6 Complaint Yes
Barebone (1) B537MY188S1 Barebone
Manual (1) MB Quick Reference + (1) BB User's manual
Installation CD (1) TYAN installation CD
Heatsink / Cooler (1) LGA771 CPU heatsink
Rail kit (1) sliding rail kit
Contains
Cable Power Cord
(2) CCBL-0310, US type power cord / (2) CCBL-0300, EU
type power cord
Optional
accessories for
future upgrade
SMDC IPMI Card M3296
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15
1.4 Standard Parts List
This section describes the YR188-B537M package contents and
accessories. Open the box carefully and ensure that all components are
present and undamaged. The product should arrive packaged as
illustrated below.
1.4.1 Box Contents Per Node
Component Description
1U chassis, 2 nodes (B537MY188S2)
1U chassis, 1 node (B537MY188S1)
(4) hot swap HDD bays per node
TYAN
®
S537M system board
(pre-installed)
450W single Power Supply
(pre-installed)
(3) System FAN
(pre-installed)
Power Distribution Board
(pre-installed)
SATA HDD Backplane Board
(pre-installed)
M2087-R PCI-E riser card
(pre-installed)
Front Panel Board
(pre-installed)
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1.4.2 Accessories
If any items are missing or appear damaged, contact your retailer or
browse to TYAN
®
’s website for service: http://www.tyan.com
The web site also provides information of other TYAN
®
products, as
well as FAQs, compatibility lists, BIOS settings, etc.
1 x TYAN
®
Motherboard Drive
CD
1 Heatsink (B537MY188S1)
2 Heatsinks (B537MY188S2)
HDD Screws
Power Cables
(Left to right: Europe, US)
1 Europe + 1 US (B537MY188S1)
2 Europe + 2 US (B537MY188S2)
Barebone Manual Mainboard Quick Reference
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Rail Kit
Rail x 2 Screw Pack
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1.5 About the Product
The following views show you the product.
1.5.1 System Front View (Per Node)
HDD LED Description
Activity LED: Off
Fault LED: Off
Drive present, no activity
Activity LED: blinking green
Fault LED: Off
Drive present, with activity
Activity LED: Off
Fault LED: Red
HDD Fail
Activity LED: random
Fault LED: blinking red @ 4 Hz
Identify
Activity LED: random
Fault LED: blinking red @ 1 Hz
Rebuild
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Front Panel LED Description
Power Green: Power On
IPMI
Green: Normal Status
Amber: System Failed
Without IPMI module:
FAN failed
system thermal problem
With IPMI module:
IPMI fault alert event is raised.
LAN1
Green: Link
Blinking Green: Activity
LAN2
Green: Link
Blinking Green: Activity
HDD
Green: Ready
Blinking Green: Activity
Red: TBD
Front Panel Button Description
Power On/ Off Power up and power down the system (Use a pin)
ID (UID)
Press once and the blue ID LED on the rear panel
will light up
Reset Press to reset the system
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20
1.5.2 System Rear View (Per Node)
ÆID LED: When the ID button on the front panel is pressed, the blue
ID LED on the rear panel will light up. The technical personnel
can easily locate the system on the rack, disconnect cables
from the system, and remove it from the rack for later repair.
ÆLAN LED: The three onboard Ethernet ports have green and
amber LEDs to indicate LAN status. The table below illustrates
the different LED states.
Ethernet LAN Link/Activity LED Description
Left: slow blinking green
Right: Off
10 Mbps Link
Left: blinking green
Right: Off
10 Mbps Activity
Left: slow blinking green
Right: green
100 Mbps Link
Left: blinking green
Right: green
100 Mbps Activity
Left: slow blinking green
Right: amber
1000 Mbps Link
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Tyan YR188-B537M Manuale utente

Categoria
Server barebone
Tipo
Manuale utente

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